A digital output readout circuit with substrate temperature and bias heating compensation for uncooled micro-bolometer infrared focal plane arrays

Que, Longcheng; Wei, Linhai; Lv, Jian; Jiang, Yadong

doi:10.1016/j.infrared.2015.04.008

Cited by 5 publications

(1 citation statement)

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“…In a diode-based sensor, reference pixels and dummy metal line are two classic techniques to calibrate the IR-drop, but other non-uniformity factors are often left un-compensated [17,18]. In a microbolometer, these similar residual non-uniformities are calibrated by applying corrected bias voltage with the help of sub-DAC (Digital-to-Analog Converter) [19,20,21,22].…”

Section: Introductionmentioning

confidence: 99%

An Analog-Front ROIC with On-Chip Non-Uniformity Compensation for Diode-Based Infrared Image Sensors

Zhao

et al. 2019

Sensors

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This paper proposes a CMOS front-end readout-integrated circuit (ROIC) with on-chip non-uniformity compensation technique for a diode-based uncooled infrared image sensor. Two techniques are adopted to achieve on-chip non-uniformity compensation: a reference dummy metal line is introduced to alleviate the dominant non-uniformity with IR-drop presented in large pixel array, and a current splitting architecture-based variable current source for diode bias is proposed to compensate other residual non-uniformity. A differential integrator is chosen as the main amplifier of readout circuit for its superior noise performance. For low power design, a pulse-powered row buffer is designed in this work. The proposed ROIC for 384 × 288 diode-based detector array is fabricated with a 0.35-μm CMOS process. It occupies an area of 4.4 mm × 15 mm, and the power consumption is 180 mW. The measured result shows that with the proposed on-chip non-uniformity compensation, the output voltage variation is greatly reduced from 2.5 V to 60 mV.

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