2021 33rd International Symposium on Power Semiconductor Devices and ICs (ISPSD) 2021
DOI: 10.23919/ispsd50666.2021.9452217
|View full text |Cite
|
Sign up to set email alerts
|

A Direct Bond Fabrication Process for Compact GaN Intelligent Power Modules on Liquid Coolers for EV Applications

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...

Citation Types

0
0
0

Year Published

2021
2021
2024
2024

Publication Types

Select...
3
1

Relationship

0
4

Authors

Journals

citations
Cited by 4 publications
references
References 2 publications
0
0
0
Order By: Relevance