A Facile Strategy for Non-fluorinated Intrinsic Low-k and Low-loss Dielectric Polymers: Valid Exploitation of Secondary Relaxation Behaviors

Qian, Chao; Fan, Zhongjie; Zheng, Weiwen; Bei, Runxin; Zhu, Tianwen; Liu, Siwei; Chi, Zhenguo; Aldred, Matthew P.; Chen, Xudong; Zhang, Yi; Xu, Jiarui

doi:10.1007/s10118-020-2339-4

Cited by 32 publications

(15 citation statements)

References 39 publications

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“…Goto et al prepared a series of PIs with low D k s by introducing bulky diphenyl fluorenylidene moieties and concluded that the D k values of PIs were closely related to the imide group content (Imide%) in the repeating unit and fluorine content (F%). Based on their findings, various PIs with low D k have been reported. − Our previous works on low D k PIs also revealed that incorporation of phenylene ether and adamantyl and alicyclic units to dianhydrides and diamines could effectively decrease the D k values of PIs. − Most of the above studies focused on the development of PIs with low D k values at lower frequencies (1 kHz to 10 MHz). , However, few studies investigate the molecular structure of PIs with low D k as well as low D f . − In particular, there is no clear guideline for designing PIs with both low D k and low D f , which is very important for the emerging 5G mobile communications technology. Therefore, it is of great interest and a challenge to establish the design concept of low D k and low D f PIs.…”

Section: Introductionmentioning

confidence: 99%

Correlating the Molecular Structure of Polyimides with the Dielectric Constant and Dissipation Factor at a High Frequency of 10 GHz

Kuo

Lin

Chen

et al. 2020

ACS Appl. Polym. Mater.

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The relationships between the structure and the dielectric properties of polyimides (PIs) were extensively studied to construct universal correlations of dielectric constant (D k ) and dissipation factor (D f ) on the structural parameters. In this study, 36 kinds of PIs with a plethora of functional groups including ether, fluorine, amide, ester, ketone, sulfide, sulfone, and alkane groups were prepared by polyaddition and thermal imidization. Accordingly, their thermal, mechanical, and dielectric properties were systematically investigated. The experimental results showed highly correlated relationships between the D k values and two structural parameters of fluorine content (F%) and volume polarizability (P/V) with a correlation coefficient of 0.98 and 0.90, respectively. Likewise, the D f value was highly correlated to the imide group content (Imide%) with a correlation coefficient of 0.95. However, a multiple positive trend was found in the relationship between the D f values and the volume dipole moment (μ/V) for the PIs. The discrepancy might be resulted from the difficulty to elucidate local molecular motions in the unit structure of PIs. Nevertheless, the D f values still presented a nontrivial relation to the orientational polarization and dipole moment of the unit structures. Collectively, our experimental results revealed the structure−dielectric properties relationships of the PIs by rational definition on a series of structural parameters and warrant further investigation. Meanwhile, this work provides systematic guidelines for molecular structure design of PIs which are promising for high frequency applications on the fifth-generation (5G) mobile communications technology.

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Section: Introductionmentioning

confidence: 99%

Correlating the Molecular Structure of Polyimides with the Dielectric Constant and Dissipation Factor at a High Frequency of 10 GHz

Kuo

Lin

Chen

et al. 2020

ACS Appl. Polym. Mater.

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“…The thermal stability of the ANF aerogel was characterized by a Netzsch thermal analyzer (TGA, 209 F1) in a nitrogen atmosphere with a heating rate of 10 °C/min. The porosity of the aerogels was determined by measuring the apparent density of the aerogels and calculated according to eq 2, in which ρ s and ρ a represent the density of the ANF skeleton (1.44 g/cm 3 ) and the apparent density of the ANF aerogel, respectively. ρ a was determined as the ratio of mass to volume of the aerogel, in which the volume of the aerogel was determined by measuring the dimension of the aerogel with a regular shape.…”

Section: Methodsmentioning

confidence: 99%

Ambient Drying Route to Aramid Nanofiber Aerogels with High Mechanical Properties for Low-k Dielectrics

Liu

Robertson

Qiang

et al. 2022

ACS Appl. Polym. Mater.

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Polymeric aerogels with low dielectric constant (low-k) are an important material solution for applications in high-frequency terminal electronic devices. However, most aerogels are prepared using high-cost supercritical drying or freeze-drying methods and typically exhibit poor mechanical properties and low thermal stability, which limits their use in practical applications. Here, we report the fabrication of aerogels with layered structure and hierarchical nanopores based on aramid nanofibers (ANFs), using a vacuum-assisted filtration method followed by low-cost ambient drying. The porosity of the ANF aerogels can be controlled from 38 to 79% by rationally selecting solvents with different surface tension for solvent exchange, tuning the affinity between solvents and ANF skeletons as well as controlling the solvent evaporation rate during the ambient drying process. The ANF aerogels have an ultralow and tunable dielectric constant as low as 1.56 while exhibiting a low dielectric loss between 0.0040 to 0.0055 at 1 MHz. The advantageous low-k property can be preserved at high temperatures up to 300 °C, and an inherent flame retardancy is achieved due to the rigid and all-aromatic backbone structure of poly(p-phenylene terephthalamide). Moreover, the nanoporous ANF layers with relatively lower porosity compared with the overall porosity of the aerogel provide strong mechanical strength and modulus, while the presence of larger nanopores from the interspacing of ANF layers ensures a high porosity for the entire aerogel, which endows the aerogel film with superior tensile strength and modulus compared with their conventional counterparts containing homogeneous porous structures. Collectively, these ANF aerogels exhibit low-k, outstanding mechanical properties, high thermal stability, and inherent flame retardancy, enabling them to become very promising next-generation dielectric materials.

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“…With the rapid advent of the fifth-generation (5G) mobile communication era, the fast development of large-scale integrated circuits has created an urgent demand for the high performance of interlayer media [1]. However, the resistance-capacitance time delay, the crosstalk noise between lines, and the power dissipation in devices have become the primary bottlenecks in integrated circuit development [2,3]. Therefore, there is a great demand for low dielectric materials as insulating interlayers with good thermal resistance, low water absorption, and excellent mechanical properties for microelectronics.…”

Section: Introductionmentioning

confidence: 99%

Construction of micro-branched crosslink fluorinated polyimide with ultra-low dielectric permittivity and enhanced mechanical properties

Zhao¹,

Cao²,

Huang³

et al. 2022

Express Polym. Lett.

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There is a great demand for low dielectric materials as insulating interlayers in large-scale integrated circuit development. However, it is still a huge challenge to reduce the dielectric permittivity of polymers while maintaining excellent thermal stability and mechanical properties. In this work, the fluorinated polyimides (PIs) in combination with a micro-branched crosslinking structure were prepared successfully by introducing different amounts of 1,3,5-tris(4-aminophenyl) benzene (TAPB) to obtain ultra-low dielectric permittivity. The results revealed that PI film containing 2 mmol TAPB had the lowest dielectric permittivity (2.47) and dielectric loss (0.008) at 1 MHz due to the fluorine atoms and the micro-branched crosslink structure, which not only decreased the molecular polarizability but also increased the free fractional volume. In addition, PI film containing 2 mmol TAPB had the highest tensile strength of 106.02 MPa with an elongation at a break of 15.1% because the presence of TAPB effectively promoted the connection between PI molecular chains, resulting in the inhibition of the molecular mobility. The incorporation of TAPB also enhanced the thermal stability and ultraviolet light-shielding performance of PI films. This method paves the way for the development of PIs with ultra-low dielectric permittivity for the electronic industry.

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A Facile Strategy for Non-fluorinated Intrinsic Low-k and Low-loss Dielectric Polymers: Valid Exploitation of Secondary Relaxation Behaviors

Cited by 32 publications

References 39 publications

Correlating the Molecular Structure of Polyimides with the Dielectric Constant and Dissipation Factor at a High Frequency of 10 GHz

Correlating the Molecular Structure of Polyimides with the Dielectric Constant and Dissipation Factor at a High Frequency of 10 GHz

Ambient Drying Route to Aramid Nanofiber Aerogels with High Mechanical Properties for Low-k Dielectrics

Construction of micro-branched crosslink fluorinated polyimide with ultra-low dielectric permittivity and enhanced mechanical properties

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