Proceedings. ISPSD '05. The 17th International Symposium on Power Semiconductor Devices and ICs, 2005.
DOI: 10.1109/ispsd.2005.1487963
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A fast and flexible thermal simulation tool validated on smart power devices

B. Desoete
1
,
P. Moens
2
,
Renaud Gillon
3
et al.
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Cited by 4 publications
(1 citation statement)
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“…On the other hand, thermal simulation tools have been used to optimize thermal design of the devices and system in package [10,11].…”
Section: Introductionmentioning
confidence: 99%

Investigation of smart power DMOS devices under repetitive stress conditions using transient thermal mapping and numerical simulation

Bychikhin
1
,
Haberfehlner
2
,
Rhayem
3
et al. 2010
Microelectronics Reliability
1
0
1
0
View full textAdd to dashboardCite
“…On the other hand, thermal simulation tools have been used to optimize thermal design of the devices and system in package [10,11].…”
Section: Introductionmentioning
confidence: 99%

Investigation of smart power DMOS devices under repetitive stress conditions using transient thermal mapping and numerical simulation

Bychikhin
1
,
Haberfehlner
2
,
Rhayem
3
et al. 2010
Microelectronics Reliability
1
0
1
0
View full textAdd to dashboardCite

Thermal imaging of smart power DMOS transistors in the thermally unstable regime using a compact transient interferometric mapping system

Haberfehlner
1
,
Bychikhin
2
,
Dubec
3
et al. 2009
Microelectronics Reliability
12
0
3
0
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Aspects of robust mixed-signal design in smart-power IC processes

Gillon
1
2005
Proceedings of the IEEE International Symposium on Industrial Electronics, 2005. ISIE 2005.
2
0
0
0
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