2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) 2023
DOI: 10.1109/ectc51909.2023.00331
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A Fully Additive Fabrication Approach for sub-10-Micrometer Microvia Suitable for 3-D System-in-Package Integration

Roghayeh Imani1,
Shailesh Singh Chouhan2,
Jussi Putaala
3
et al.
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