A Gain and Bandwidth Individually Tunable ExG Analog Frontend with 516nV<sub>rms</sub> Noise for Flexible Biomedical Sensors

Suo, Yanxing; Xiao, Han; Zhao, Yang; Chen, Mingyi; Li, Yongfu; Liu, Yan; Lian, Yong

doi:10.1109/iscas46773.2023.10181843

Cited by 3 publications

(4 citation statements)

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“…One can achieve a noise floor around 100 nV/√Hz (0.98 μV rms IRN) at 1 μA current consumption and 1.7 mm 2 chip area [95] . A recent design, drawing more current, that is, 2.5 μA, effectively suppressed the noise to 40 nV/√Hz (0.516 μV rms ) within a compact area of 0.3 mm 2 [96] . In this view, Rémi Dekimpe et al.…”

Section: High‐density Neural Recording Chipsmentioning

confidence: 98%

“…[95] A recent design, drawing more current, that is, 2.5 μA, effectively suppressed the noise to 40 nV/√Hz (0.516 μV rms ) within a compact area of 0.3 mm 2 . [96] In this view, Rémi Dekimpe et al reported the chopping stabilized capacitive coupled instrument amplifier (CS-CCIA) to achieve 750 nV rms IRN at 1.17 μA current and 0.024 mm 2 area, [97] showing excited noise effective factor (NEF) and area efficiency. Recently, a group chopping approach was devised for an 8-channel AFE, obtaining a remarkable 420 nV rms IRN at a minimum cost of 2.4 μW power and 0.017 mm 2 area.…”

Section: Noise Suppressionmentioning

confidence: 99%

“…The low-frequency differential is then up-modulated by CH out while the signal is demodulated and thus separated with the differential interferences induced by CM variation, achieving 120 dB CMRR and 516 nV rms IRN, all within 0.3 mm 2 chip area. [96] Adopting an AFE with high PSRR cleans the recording ripples due to power line variations while avoiding the usage of the power-inefficient LDO. It thereby reduces the total system power.…”

Section: Channel Crosstalkmentioning

confidence: 99%

“…This common‐mode signal cannot be modulated by CH in and then translated into low‐frequency differential output after A 0 . The low‐frequency differential is then up‐modulated by CH out while the signal is demodulated and thus separated with the differential interferences induced by CM variation, achieving 120 dB CMRR and 516 nV rms IRN, all within 0.3 mm 2 chip area [96] …”

Section: High‐density Neural Recording Chipsmentioning

confidence: 99%

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High‐density implantable neural electrodes and chips for massive neural recordings

Wang,

Suo,

Wang

et al. 2024

Brain-X

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High‐density neural recordings with superior spatiotemporal resolution powerfully unveil cellular‐scale neural communication, showing great promise in neural science, translational medicine, and clinical applications. To achieve such, many design and fabrication innovations enhanced the electrode, chip, or both for biocompatibility improvement, electrical performance upgrade, and size miniaturization, offering several thousands of recording sites. However, an enormous gap exists along the trajectory toward billions of recording sites for brain scale resolution, posing many more design challenges. This review tries to find possible insight into mitigating the gap by discussing the latest progress in high‐density electrodes and chips for neural recordings. It emphasizes the design, fabrication, bonding techniques, and in vivo performance optimization of high‐density electrodes. It discusses the promising opportunities for circuit‐level and architecture‐level multi‐channel chip design innovations. We expect that joint effort and close collaboration between high‐density electrodes and chips will pave the way to high‐resolution neural recording tools supporting cutting‐edge neuroscience discoveries and applications.

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Section: High‐density Neural Recording Chipsmentioning

confidence: 98%