A Highly Conductive and Tough Binary Metalgel

Abstract

Materials that combine metallic electrical conductivity and high toughness are in great demand for advancing flexible electronics. However, such materials are still lacking. Previously reported flexible materials with metallic conductivity (≥1 × 106 S·m‒1) usually compromise on toughness (<3 MJ·m‒3). Here, a binary metalgel is presented that features a binary metal continuum stabilized by a three‐dimensional polymer network. The binary metal continuum consists of hard metal particles encapsulated by soft liquid metal. The continuous conductive pathways within the polymer network enable a metallic electrical conductivity of 2.50 × 106 S·m‒1. Additionally, the combination of hard metal particles, soft liquid metal, and polymer network facilitates stress transfer throughout the material, creating a triple‐mode energy dissipation mechanism that enhances toughness to 14.40 MJ·m‒3. This strategy offers a valuable framework for developing materials that achieve both superior electrical and mechanical properties.