2024 International Conference on Electronics, Information, and Communication (ICEIC) 2024
DOI: 10.1109/iceic61013.2024.10457196
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A Highly-Sensitive and Compact Interconnect Delay Monitoring Circuit for 3-Dimensional System Packages

Seung-Mo Noh,
Seungkyu Kim,
Seo-Yoon Lee
et al.
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