A multi-phase-field model of void crossing grain boundary under electromigration-induced anisotropic surface diffusion in interconnects

Guo, Yuanzhe; Huang, Peizhen

doi:10.1016/j.euromechsol.2024.105305

European Journal of Mechanics - A/Solids

2024

DOI: 10.1016/j.euromechsol.2024.105305

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A multi-phase-field model of void crossing grain boundary under electromigration-induced anisotropic surface diffusion in interconnects

Yuanzhe Guo,

Peizhen Huang

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An electro-thermo-mechanical coupling phase-field model of defect evolution induced by electromigration in interconnects

Wu,

Chen,

2025

International Journal of Mechanical Sciences

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An electro-thermo-mechanical coupling phase-field model of defect evolution induced by electromigration in interconnects

Wu,

Chen,

2025

International Journal of Mechanical Sciences

View full text Add to dashboard Cite

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A multi-phase-field model of void crossing grain boundary under electromigration-induced anisotropic surface diffusion in interconnects

Cited by 1 publication

References 29 publications

An electro-thermo-mechanical coupling phase-field model of defect evolution induced by electromigration in interconnects

An electro-thermo-mechanical coupling phase-field model of defect evolution induced by electromigration in interconnects

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