A new operating regime for electroplating the gold absorber on x-ray masks

Dauksher, William J.; Resnick, Douglas J.; Johnson, William A.; Yanof, Arnold W.

doi:10.1016/0167-9317(94)90145-7

Cited by 28 publications

(23 citation statements)

References 3 publications

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“…The release of free cyanide during the reduction of [Au(CN) 2 ] À can be incompatible with positive photoresists used in the microelectronics industry [41,42]. It has also been found that the residual stress of the plated gold can be controlled in noncyanide baths [43,44]. Low-stress deposits are of particular interest for X-ray lithography masks because they must be thin, flat, and made from high-atomic-number elements.…”

Section: Noncyanide Bathsmentioning

confidence: 99%

“…For example, Figure 4.6 shows the stress change from compressive to tensile as the temperature or current is raised. Thallium was used as the stressreducing agent at concentrations up to 80 ppm, a value that can be more easily maintained than the low-thallium-concentration baths [43]. Alkaline sulfite baths can also be used without the use of thallium, which itself is a health hazard [44].…”

Section: Noncyanide Bathsmentioning

confidence: 99%

“…Structural aspects of gold deposits, such as grain size, are best determined by transmission electron microscopy. While sample preparation can require considerable effort, the results are irreplaceable [34,43]. A technique known as through-focus imaging was used to observe organic and gaseous inclusions in gold, which cannot be done by conventional imaging techniques [34].…”

Section: Chemical Analysismentioning

confidence: 99%

“…(b) Stress versus current denisty for samples plated at 50 C from a bath containing 75 ppm thallium. (From Dauksher et al[43].…”

mentioning

confidence: 99%

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Electrodeposition of Gold

Kohl¹

2010

Modern Electroplating

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While all that glitters may not be gold, it is the most beautiful of all the elements in their pure form. The name gold comes from the Old English Anglo-Saxon word for geolo meaning "yellow" while the symbol, Au, comes from the Latin word aurum, meaning "glowing dawn." Historically gold was one of the first metals known. Gold has been valuable throughout the ages chiefly because of its physical properties of softness, ductility, corrosion resistance, density, and scarcity. The first gold coin dates back to about 560 BC. Gold cups and jewelry predating 3500 BC have been found in Iraq. The ancient Egyptians knew how to hammer gold into leaf as thin as 66 nm. The importance of gold as a form of currency was at a high point in the 1900s when most countries were on the gold standard. The bullion price of gold over the past 21 years is shown in Figure 4.1.There have been about 160 metric kilotons of gold mined since it was first discovered, and it occupies about 0.005 ppm of the earth's crust. The world demand for gold in 2007 was approximately 80,000,000 troy ounces. Figure 4.2 shows the breakdown of the gold usage by industry. Jewelry comprises the largest fraction of the usage; however, much of that is not electroplated. For jewelry applications, gold is commonly alloyed with group IB or IIB metals, particularly copper, silver, platinum, and palladium, principally to improve its strength and wear resistance.The electrodeposition of gold is a relatively new process; it has been traced to the early work of Brugnatelli in 1805 [1]. The motives behind the use of electroplated gold changed dramatically in the mid-twentieth century when the emerging electronics industry required special-purpose electrical connections. The electronics industry consumed 5,330,000 troy ounces in 1994. Figure 4.3 shows the growth in the use of gold in the electronics industry by year. The use of electroplated gold in a variety of different functions in the electronics industry has led to (1) many advances in our fundamental understanding of the electrodeposition process and (2) new electroplating technologies over the past 25 years.Electrochemically deposited gold has satisfied many of the demands of the electronics industry. Gold has the third best electrical and thermal conductivity of all metals at room temperature. Also it has high ductility and excellent wear resistance, which are important for electrical contacts. The inertness of gold prevents the formation of insulating surface oxides (as compared to metals like aluminum). Group IIB metals (e.g., gold) are not good catalysts for other reactions, thus avoiding certain problems. For example, group IB metals (particularly platinum and palladium) can catalyze the polymerization of organic molecules forming insulating layers. In addition, gold is an excellent metal for wire bonding integrated circuits (ICs). Gold wires can be bonded to pure, soft gold pads by thermocompression bonding (300-400 C at high pressure to form a weld) or thermosonic bonding (150-200 C with ultrasonic energy to fo...

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Section: Noncyanide Bathsmentioning

confidence: 99%

Section: Noncyanide Bathsmentioning

confidence: 99%

Section: Chemical Analysismentioning

confidence: 99%

“…(b) Stress versus current denisty for samples plated at 50 C from a bath containing 75 ppm thallium. (From Dauksher et al[43].…”

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confidence: 99%

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Electrodeposition of Gold

Kohl¹

2010

Modern Electroplating

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“…The high-quality gold film deposition from a solution with a trace amount of As(III) was reported later [6], and gold film with superior properties was described. Recently a number of processes based on gold reduction from sulfite were formulated to obtain gold films suitable for X-ray lithography and microtechnical devices [7][8][9][10].…”

Section: Introductionmentioning

confidence: 99%

Electrochemical gold deposition from sulfite solution: application for subsequent polyaniline layer formation

et al. 2008

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Electrochemical gold deposition from sulfite solutions was studied by means of voltammetry, EIS and EQCM. A gold film electrode was used for polyaniline layer formation by electrochemical oxidation of aniline. The standard electrochemical reduction potential of the reaction [Au(SO 3 ) 2 ] 3-+ e -= Au + 2 SO 3 2-was determined, and is equal to 0.116 V (vs. NHE). Both solution stirring and temperature increase accelerate the electrochemical reduction of gold, when the electrode potential is below -0.55 V. When the potential is above -0.55 V the electrochemical reduction proceeds via passive layer formation. Our study suggests that the passive layer consists of chemically adsorbed sulfite ions and sulfur. The gold film deposited from sulfite solution is a high quality substrate suitable for conducting polymer layer formation. This technique, where a polymer layer electrode is prepared by thin gold film deposition onto a metal surface and by subsequent polymer layer formation, can be applied in sensor research and technology.

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Photomask Etching

Resnick¹

2000

Handbook of Advanced Plasma Processing Techniques

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A new operating regime for electroplating the gold absorber on x-ray masks

Cited by 28 publications

References 3 publications

Electrodeposition of Gold

Electrodeposition of Gold

Electrochemical gold deposition from sulfite solution: application for subsequent polyaniline layer formation

Photomask Etching

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