2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm) 2022
DOI: 10.1109/itherm54085.2022.9899554
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A Novel Cost-Efficient High-Performance Aluminum Cold Plate Solution for Liquid Cooling System

Xianguang Tan1,
Su Li2,
Hongmei Li3
et al.
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A Novel Cost Efficient Cold Plate Liquid Cooling Solution for Data Center Deployment

Wu
1
,
He
2
,
Zheng
3
et al. 2023
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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A Novel Cost Efficient Cold Plate Liquid Cooling Solution for Data Center Deployment

Wu
1
,
He
2
,
Zheng
3
et al. 2023
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
0
0
0
0
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A Novel Cost-effective Liquid Assisted Air Cooling Solution For High TDP Server System

Liang,
Wu,
Xu
et al. 2023
2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
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