2023 IEEE International Ultrasonics Symposium (IUS) 2023
DOI: 10.1109/ius51837.2023.10306843
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A Novel Fabrication Process for Thin, Flexible, Backside-accessible Polymer-based CMUTs for Acoustic Emission Sensing

Jonas Welsch,
Carlos D. Gerardo,
Robert Rohling
et al.
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