A novel method of fabricating high channel density neural array for large neuronal mapping

Shandhi, Md. Mobashir Hasan; Leber, M.; Hogan, Alexander L.; Bhandari, R.; Negi, Sandeep

doi:10.1109/transducers.2015.7181286

Cited by 16 publications

(9 citation statements)

References 6 publications

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“…(Left) Scanning electron micrograph (SEM) of the 100 channel Utah Electrode Array (UEA), (Right) inset shows zoom-in view of the tip of the microneedle illustrating the active site [3]. …”

Section: Figmentioning

confidence: 99%

“…Due to the complex three dimensional structure of the UEA it is not easy to have more than one recording site per microneedle. In our previous work [3], we have presented a device, the Utah Multisite Electrode Array (UMEA), which has recording sites along and around the microneedle, making it a 3D neural array. It was envisioned that the proposed device will have 300 channels in the same foot print of the standard UEA with 100 channels.…”

Section: Introductionmentioning

confidence: 99%

“…Previously, we used laser and FIB to create isolated sites and traces along the microneedle of the UMEA [3]. Choi et al also used Excimer laser to facilitate electrodeposition of metal lines on highly inclined surface for application in 3D multi-electrode array [9].…”

Section: Introductionmentioning

confidence: 99%

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Reusable High Aspect Ratio 3-D Nickel Shadow Mask

Shandhi

Leber

Hogan

et al. 2017

J. Microelectromech. Syst.

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Shadow Mask technology has been used over the years for resistless patterning and to pattern on unconventional surfaces, fragile substrate and biomaterial. In this work, we are presenting a novel method to fabricate high aspect ratio (15:1) three-dimensional (3D) Nickel (Ni) shadow mask with vertical pattern length and width of 1.2 mm and 40 μm respectively. The Ni shadow mask is 1.5 mm tall and 100 μm wide at the base. The aspect ratio of the shadow mask is 15. Ni shadow mask is mechanically robust and hence easy to handle. It is also reusable and used to pattern the sidewalls of unconventional and complex 3D geometries such as microneedles or neural electrodes (such as the Utah array). The standard Utah array has 100 active sites at the tip of the shaft. Using the proposed high aspect ratio Ni shadow mask, the Utah array can accommodate 300 active sites, 200 of which will be along and around the shaft. The robust Ni shadow mask is fabricated using laser patterning and electroplating techniques. The use of Ni 3D shadow mask will lower the fabrication cost, complexity and time for patterning out-of-plane structures.

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“…(Left) Scanning electron micrograph (SEM) of the 100 channel Utah Electrode Array (UEA), (Right) inset shows zoom-in view of the tip of the microneedle illustrating the active site [3]. …”

Section: Figmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Reusable High Aspect Ratio 3-D Nickel Shadow Mask

Shandhi

Leber

Hogan

et al. 2017

J. Microelectromech. Syst.

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“…In the literature, many electronic circuits and systems have been proposed in order to interface with and sense very low voltage signals from dedicated or general-purpose electrodes [14][15][16][17][18][19][20], even for portable application [21], where the energy consumption is much more critical and energy harvesting techniques can be employed to remove the battery dependence or at least to increase the lifetime [22][23][24][25][26]. As a rule, the performances of these interfacing circuits, including, in most cases, buffers or amplifiers as a first stage, are limited by the DC gain, DC offset, noise, Common Mode Rejection Ratio (CMRR), and input impedance.…”

Section: Introductionmentioning

confidence: 99%

A Novel General Purpose Combined DFVF/VCII Based Biomedical Amplifier

2020

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We here present a 0.15 µm CMOS high input impedance and low noise AC coupled flipped voltage follower-based amplifier for high integration level in integrated circuits in a wide range of sensing applications. With such a circuit, it is possible to achieve a high level of integration, thanks to the absence of passive resistors, and also to implement a very high input impedance without capacitive feedback thanks to bootstrap operation, thus offering a very low high-pass cutoff frequency. Simulated results with a proven and well modeled standard technology show a whole circuit input-referred noise of 5.4 µVrms. The bias voltage is ±0.6 V with a total power consumption of the single amplifier of 20 µW. The very low circuit complexity allows a very low estimated reduced area occupation giving, as a general example, the possibility of integrating an array of up to thousands of channels for biomedical applications. Detailed simulation results, PVT analysis and comparison tables are also presented in the paper.

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“…To move the field forward, platform technology must be invented to integrate active electronics with neural recording and stimulation arrays with high reliability, and low overhead in size and complexity. This effort is especially important for scaling channel count and density to current goals (100-1000 chs/mm 2 [12], [19]- [21]). …”

Section: Introductionmentioning

confidence: 99%

Integrated neural interfaces

Walker

Rieth

Iyer

et al. 2017

2017 IEEE 60th International Midwest Symposium on Circuits and Systems (MWSCAS)

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Abstract-Electronic interfaces to the nervous system are increasingly important for experimental neuroscience as well as medical diagnostics and therapies. Existing neural interfaces are limited, however, by the use of passive recording and stimulation devices that are connected to active electronics on separate physical platforms through large amounts of passive wiring. This manuscript proposes a new approach to integrate active electronics directly with neural recording and stimulation devices using state-of-the-art silicon processing, assembly, and packaging techniques. System concepts are described for fully wireless operation as well as wireline interfacing through FDA-cleared implantable leads and connectors. The approach offers a more modular paradigm of neural interface design, which is greatly needed as the demand for higher channel counts grows.

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A novel method of fabricating high channel density neural array for large neuronal mapping

Cited by 16 publications

References 6 publications

Reusable High Aspect Ratio 3-D Nickel Shadow Mask

Reusable High Aspect Ratio 3-D Nickel Shadow Mask

A Novel General Purpose Combined DFVF/VCII Based Biomedical Amplifier

Integrated neural interfaces

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