A novel method to produce Pd nanoparticle ink for ink-jet printing technology

Tseng, Chun-Chieh; Chang, Chang-Pin; Sung, Youngje; Chen, Yann-Cheng; Ger, Ming-Der

doi:10.1016/j.colsurfa.2009.02.026

Cited by 37 publications

(14 citation statements)

References 18 publications

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“…It is noteworthy that this widely applied process clearly uses more metal than necessary, since the PVD step concerns the whole surface. Numerous alternative processes have been recently investigated such as ink‐jet printing,10–17 microcontact printing (µCP),1, 18–22 and screen printing23–25 which all lead to less wastage of metal, but are not yet available at industrial scale.…”

Section: Introductionmentioning

confidence: 99%

Localized Ligand Induced Electroless Plating (LIEP) Process for the Fabrication of Copper Patterns Onto Flexible Polymer Substrates

Garcia

Polesel-Maris

Viel

et al. 2011

Adv Funct Materials

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The “ligand induced electroless plating (LIEP) process” is a simple process to obtain localized metal plating onto flexible polymers such as poly(ethylene terephtalate) and polyvinylidene fluoride sheets. This generic and cost‐effective process, efficient on any common polymer surface, is based on the covalent grafting by the GraftFast process of a thin chelating polymer film, such as poly(acrylic acid), which can complex copper ions. The entrapped copper ions are then chemically reduced in situ and the resulting Cu0 species act as a seed layer for the electroless copper growth which, thus, starts inside the host polymer. The present work focuses on the application of the LIEP process to the patterning of localized metallic tracks via two simple lithographic methods. The first is based on a standard photolithography process using a positive photoresist masking to prevent the covalent grafting of PAA in designated areas of the polymer substrate. In the second, the patterning is performed by direct printing of the mask with a commercial laser printer. In both cases, the mask was lifted off before the copper electroless plating step, which provides ecological benefits, since only the amount of copper necessary for the metallic patterning is used.

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Section: Introductionmentioning

confidence: 99%

Localized Ligand Induced Electroless Plating (LIEP) Process for the Fabrication of Copper Patterns Onto Flexible Polymer Substrates

Garcia

Polesel-Maris

Viel

et al. 2011

Adv Funct Materials

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“…Different dopant anions (A − ) may participate in reaction (1) as both sulfate and chloride ions are brought into the film during its contact with the PdCl 2 /0.1 M H 2 SO 4 solution. However, the reduction of palladium ions by sulfateterminated PSS oligomers acting as reducing agents at heattreated conditions also may be considered as a possible concurrent mechanism of reduction [37,38]. This mechanism includes the formation of sulfite-ions and alcohol group from the thermal decomposition of PSS in aqueous dispersion, which act as reducing agents for palladium ions.…”

Section: Formation Of Pedot/pss/pd-modified Electrodesmentioning

confidence: 98%

Multi-layer PEDOT:PSS/Pd composite electrodes for hydrazine oxidation

Tolstopyatova

Kondratiev

Eliseeva

2015

J Solid State Electrochem

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In this paper, a simple and stable composite electrode PEDOT:PSS/Pd based on the intrinsically conducting polymer poly(3,4-ethylenedioxythiophene):poly(styrene sulfonate) (PEDOT:PSS) was fabricated by drop-casting. The preliminary formation of water dispersion of PEDOT:PSS with Pd nanoparticles was followed by multistep drop cast deposition for the formation of thin metal-polymer composite layers on glassy carbon electrode. The morphology of pristine and composite films as well as the size and distribution of Pd particles were characterized by scanning electron microscopy. The electrochemical properties of composite metal-polymer layers were examined by cyclic voltammetry and chronoamperometry in solution of 0.2 M phosphate buffer solutions (PBS) in the presence and absence of hydrazine. It was demonstrated that electrocatalytical oxidation of hydrazine takes place only on electrochemically accessible palladium particles, located on surface or near-surface layers of composite film. The proposed multi-layer electrodes exhibited a wide linear range of response towards hydrazine detection (from 0.4 to 100 μM) and low detection limit of 0.12 μM (S/N=3).

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“…For printed electronics, numerous metallic NPs have been developed, including Cu [32][33][34], Au [31,35,36], Pd [37,38], Ni [26], and Ag [39,40]. Among them, Ag is one of the widely used metals due to the excellent electrical conductivity and low affinity for oxygen.…”

Section: Metal Nanoparticles (Nps)mentioning

confidence: 99%

Advanced Nanomaterials, Printing Processes, and Applications for Flexible Hybrid Electronics

Park

Kim

et al. 2020

Materials

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Recent advances in nanomaterial preparation and printing technologies provide unique opportunities to develop flexible hybrid electronics (FHE) for various healthcare applications. Unlike the costly, multi-step, and error-prone cleanroom-based nano-microfabrication, the printing of nanomaterials offers advantages, including cost-effectiveness, high-throughput, reliability, and scalability. Here, this review summarizes the most up-to-date nanomaterials, methods of nanomaterial printing, and system integrations to fabricate advanced FHE in wearable and implantable applications. Detailed strategies to enhance the resolution, uniformity, flexibility, and durability of nanomaterial printing are summarized. We discuss the sensitivity, functionality, and performance of recently reported printed electronics with application areas in wearable sensors, prosthetics, and health monitoring implantable systems. Collectively, the main contribution of this paper is in the summary of the essential requirements of material properties, mechanisms for printed sensors, and electronics.

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A novel method to produce Pd nanoparticle ink for ink-jet printing technology

Cited by 37 publications

References 18 publications

Localized Ligand Induced Electroless Plating (LIEP) Process for the Fabrication of Copper Patterns Onto Flexible Polymer Substrates

Localized Ligand Induced Electroless Plating (LIEP) Process for the Fabrication of Copper Patterns Onto Flexible Polymer Substrates

Multi-layer PEDOT:PSS/Pd composite electrodes for hydrazine oxidation

Advanced Nanomaterials, Printing Processes, and Applications for Flexible Hybrid Electronics

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