2024 IEEE 74th Electronic Components and Technology Conference (ECTC) 2024
DOI: 10.1109/ectc51529.2024.00328
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A novel plasma etching technology of RIE-lag free TSV and dicing processes for 3D chiplets interconnect

Taichi Suzuki,
Kenta Doi,
Toshiyuki Nakamura
et al.
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