A Novel Technique for the Connection of Ceramic and Titanium Implant Components Using Glass Solder Bonding

Abstract

Both titanium and ceramic materials provide specific advantages in dental implant technology. However, some problems, like hypersensitivity reactions, corrosion and mechanical failure, have been reported. Therefore, the combining of both materials to take advantage of their pros, while eliminating their respective cons, would be desirable. Hence, we introduced a new technique to bond titanium and ceramic materials by means of a silica-based glass ceramic solder. Cylindrical compound samples (Ø10 mm × 56 mm) made of alumina toughened zirconia (ATZ), as well as titanium grade 5, were bonded by glass solder on their end faces. As a control, a two-component adhesive glue was utilized. The samples were investigated without further treatment, after 30 and 90 days of storage in distilled water at room temperature, and after aging. All samples were subjected to quasi-static four-point-bending tests. We found that the glass solder bonding provided significantly higher bending strength than adhesive glue bonding. In contrast to the glued samples, the bending strength of the soldered samples remained unaltered by the storage and aging treatments. Scanning electron microscopy (SEM) and energy-dispersive X-ray (EDX) analyses confirmed the presence of a stable solder-ceramic interface. Therefore, the glass solder technique represents a promising method for optimizing dental and orthopedic implant bondings.

Retentive Force of Glass-Ceramic Soldered Customized Zirconia Abutment Copings with Prefabricated Titanium Bases

“…To our knowledge, there are only two studies to date that have dealt with the joining of titanium and zirconia using glass solder. Mick et al investigated the bending strength of the glass solder bond between titanium and zirconia [ 20 ]. For this purpose, titanium and zirconia cylinders with diameters of 10 mm were fabricated and sandblasted on the base and top surfaces.…”

“…After autoclave sterilization at 134 °C, no impairment of the glass solder bond could be detected either. Similarly, Mick et al could not detect any negative influence of aging at 70 °C below 4.9 bar on the specimens joined with glass solder [ 20 ].…”

“…This is not consistent with previous publications. For the evaluation of the fracture surfaces, Mick et al used SEM and EDX, while Vu et al used light microscopy with 25× magnification [ 20 , 21 ]. In both studies, the bond most frequently failed cohesively in the glass solder or in the area of the glass solder-titanium bond.…”

“…In a four-point bending test, Mick et al determined strength values of 104–119 MPa between zirconia and titanium cylinders joined with glass–ceramic solder. On average, these values were five times higher than those of a control group luted with composite (13–30 MPa) [ 20 ]. In the other study, Vu et al observed up to twice as high bond forces in the glass solder group (14–17 MPa) compared to the control group luted with a composite (8 MPa) in shear tests of zirconia and titanium cylinders joined with glass–ceramic solder [ 21 ].…”

RESISTENCIA AL CORTE DE UNIONES Al 2 O 3 -Nb PRODUCIDAS POR SOLDADURA FUERTE USANDO UNA ALEACIÓN Cu-Zn COMO ELEMENTO DE UNIÓN

“…On the other side. Mick et al (2015) have studied a technique to produce Al 2 O 3 /Ti implant components using glass solder bonding. Two main problems normally occur when joining ceramics to metals: the first is the poor wettability of ceramics by most metals and metallic alloys, which can be overcome by using an active filler alloy.…”