A numerical model for bottom-up copper electrodeposition of TSV with additives

Abstract

The kinetics which explained the copper Superfilling by electrodeposition was investigated since the copper electrodeposition became the standard technique for TSV. In order to interpret the bottom-up Superfilling process conveniently and exactly, a numerical model focused on the mass which can make the copper deposition in the via is built. This model only considered the effect of accelerator and cupric which directly affect the electrodeposition velocity in the via. The effect of two species in the numerical model is represented to two reaction constants k r and k A . Both of two constants are the compound parameters including desorption, adsorption and reaction of deposition mass. Experimental electrodeposition of variable dimension via is used to verify the accuracy of a numerical model. The results show that the model can demonstrate the electrodeposition process of via which is 50μm in diameter.