A Review on the Development of Adding Graphene to Sn-Based Lead-Free Solder

Li, Yilin; Yu, Shuyuan; Li, Liangwei; Song, Shijie; Qin, Wei; Qi, Da; Yang, Wenchao; Zhan, Yongzhong

doi:10.3390/met13071209

Cited by 5 publications

(2 citation statements)

References 95 publications

(113 reference statements)

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“…Graphene nanosheets (GNSs) are two-dimensional materials derived from graphene, with ultra-thin thickness, a melting point of 3652 °C, high strength and stiffness, excellent electronic structure, and high specific surface area [ 108 ]. When added to SnBi solder, GNSs significantly improve the mechanical properties of the solder and provide it with a certain degree of corrosion resistance [ 109 ].…”

Section: Methods and Measures Of Electromigration Mitigation For Snbi...mentioning

confidence: 99%

Research Overview on the Electromigration Reliability of SnBi Solder Alloy

Li,

Guo,

et al. 2024

Materials

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Due to the continuous miniaturization and high current-carrying demands in the field of integrated circuits, as well as the desire to save space and improve computational capabilities, there is a constant drive to reduce the size of integrated circuits. However, highly integrated circuits also bring about challenges such as high current density and excessive Joule heating, leading to a series of reliability issues caused by electromigration. Therefore, the service reliability of integrated circuits has always been a concern. Sn-based solders are widely recognized in the industry due to their availability, minimal technical issues during operation, and good compatibility with traditional solders. However, solders that are mostly Sn-based, such as SAC305 and SnZn, have a high melting point for sophisticated electronic circuits. When Bi is added, the melting point of the solder decreases but may also lead to problems related to electromigration reliability. This article reviews the general principles of electromigration in SnBi solder joints on Cu substrates with current flow, as well as the phenomena of whisker formation, voids/cracks, phase separation, and resistance increase caused by atomic migration due to electromigration. Furthermore, it explores methods to enhance the reliability of solder joint by additives including Fe, Ni, Ag, Zn, Co, RA (rare earth element), GNSs (graphene nanosheets), FNS (Fullerene) and Al2O3. Additionally, modifying the crystal orientation within the solder joint or introducing stress to the joint can also improve its reliability to some extent without changing the composition conditions. The corresponding mechanisms of reliability enhancement are also compared and discussed among the literature.

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Section: Methods and Measures Of Electromigration Mitigation For Snbi...mentioning

confidence: 99%

Research Overview on the Electromigration Reliability of SnBi Solder Alloy

Li,

Guo,

et al. 2024

Materials

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“…To improve the performance of Sn58Bi lead-free solder, a large amount of research based on experimental approaches has been proposed; for example, nanoparticles, metal compounds, and trace elements were added to Sn58Bi lead-free solder [11][12][13][14][15]. Jeong et al [16] studied the effects of different Ag nanoparticle (Ag-NP) content on the interface reaction and mechanical properties of Sn58Bi solder joints.…”

Section: Introductionmentioning

confidence: 99%

Mechanical Response of Cu/Sn58Bi-xNi/Cu Micro Solder Joint with High Temperatures

Kong,

Zhai,

et al. 2024

Crystals

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Sn58Bi solder is considered a promising lead-free solder that meets the performance requirements, with the advantages of good wettability and low cost. However, the low melting point characteristic of Sn58Bi poses a serious threat to the high-temperature reliability of electronic products. In this study, Sn58Bi solder alloy based on nickel (Ni) functionalization was successfully synthesized, and the effect of a small amount of Ni on creep properties and hardness of Cu/Sn58Bi/Cu micro solder joints at different temperatures (25 °C, 50 °C, 75 °C, 100 °C) was investigated using a nanoindentation method. The results indicate that the nanoindentation depth of micro solder joints exhibits a non-monotonic trend with increasing Ni content at different temperatures, and the slope of the indentation stage curve decreases at 100 °C, showing that the micro solder joints undergo high levels of softening. According to the observation of indentation morphology, Ni doping can reduce the indentation area and accumulation around the indentation, especially at 75 °C and 100 °C. In addition, due to the severe creep phenomenon at 100 °C, the indentation hardness rapidly decreases. The indentation hardness values of micro solder joints of Cu/Sn58Bi/Cu, Cu/Sn58Bi-0.1Ni/Cu, and Cu/Sn58Bi-0.2Ni/Cu at 100 °C are 14.67 ± 2.00 MPa, 21.05 ± 2.00 MPa, and 20.13 ± 2.10 MPa, respectively. Nevertheless, under the same temperature test conditions, the addition of Ni elements can improve the high-temperature creep resistance and hardness of Cu/Sn58Bi/Cu micro solder joints.

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