A Risk Assessment Method for Void in SnAg Solder Bump Influence on Reliability of Flip Chip Packaging

Hu, Anmin; Long, Xinjiang; Li, Ming

doi:10.1109/icept.2018.8480578

2018 19th International Conference on Electronic Packaging Technology (ICEPT) 2018

DOI: 10.1109/icept.2018.8480578

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A Risk Assessment Method for Void in SnAg Solder Bump Influence on Reliability of Flip Chip Packaging

Anmin Hu

Xinjiang Long

Ming Li

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A Risk Assessment Method for Void in SnAg Solder Bump Influence on Reliability of Flip Chip Packaging

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