2019 IEEE 69th Electronic Components and Technology Conference (ECTC) 2019
DOI: 10.1109/ectc.2019.00038
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A Study of 3D Packaging Interconnection Performance Affected by Thermal Diffusivity and Pressure Transmission

Jin-San Jung
1
,
Hyeong Gi Lee
2
,
Jimin Kim
3
et al.
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Cited by 6 publications
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