A Study of Bonding Materials for GHz Ultrasonic Wavefront Computing

Chen, Ssu-Han; Sarafianou, Mantalena; Wai, Eva; Sharma, Jaibir; Lal, Amit; Chai, Kevin Tshun Chuan

doi:10.1109/ius54386.2022.9958758

2022 IEEE International Ultrasonics Symposium (IUS) 2022

DOI: 10.1109/ius54386.2022.9958758

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A Study of Bonding Materials for GHz Ultrasonic Wavefront Computing

Ssu-Han Chen

Mantalena Sarafianou

Eva Wai

et al.

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Cited by 5 publications

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MEMS-Silicon Chip Bonding Verification using GHz Pulse-echo Simulation and Measurements

Trivedi,

Yeo,

Sarafianou

et al. 2023

2023 Joint Conference of the European Frequency and Time Forum and IEEE International Frequency Control Symposium (EFTF/IFCS)

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A Study of Bonding Materials for GHz Ultrasonic Wavefront Computing

Cited by 5 publications

References 8 publications

MEMS-Silicon Chip Bonding Verification using GHz Pulse-echo Simulation and Measurements

MEMS-Silicon Chip Bonding Verification using GHz Pulse-echo Simulation and Measurements

Investigation of Au-AuSn Bonding Below Eutectic Temperature for Gigahertz Bulk Acoustic Wave Transmission

Investigation of Void-free Chip-to-Chip Bonding Methods for CMOS-MEMS Compatibility

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