A Study of Chip-Package Interaction with All-Copper Interconnections on Advanced Glass Substrates

Sosa, Ramón A.; Surillo, Emanuel Torres; Molina-Mangual, Christian; Smet, Vanessa

doi:10.1109/ectc51529.2024.00394

2024 IEEE 74th Electronic Components and Technology Conference (ECTC) 2024

DOI: 10.1109/ectc51529.2024.00394

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A Study of Chip-Package Interaction with All-Copper Interconnections on Advanced Glass Substrates

Ramón A. Sosa,

Emanuel Torres Surillo,

Christian Molina-Mangual

et al.

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A Study of Chip-Package Interaction with All-Copper Interconnections on Advanced Glass Substrates

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References 21 publications

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