2018 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) 2018
DOI: 10.1109/ipfa.2018.8452535
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A Study of Pattern Density and Process Variations Impact on the Reliability Performance of Multi-Level Capacitance Structure in Low-k Copper Interconnects

Qian Chen
1
,
Lanfei Xie
2
,
Ramasamy Chockalingam
3
et al.
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