A study of the thermal cure of a phenylethynyl‐terminated imide model compound and a phenylethynyl‐terminated imide oligomer (PETI‐5)

“…[23][24][25][26][27][28] Solid-state 13 C-NMR, FT-IR and ESR analyses have brought some insight into the cure mechanism of arylacetylene group. The results demonstrated that the arylacetylene group underwent cyclotrimerization, hydrogen addition, DielsAlder cycloaddition, etc., and formed a complex crosslinked structure like condensed polycyclic aromatic structure during the cross-linking process.…”

Section: Methodsmentioning

confidence: 99%

Synthesis and Characteristic of Novel Soluble Triazoleimide Oligomers with Terminated Arylacetylene

Zhou¹,

Du²,

Wan³

et al. 2010

Bulletin of the Korean Chemical Society

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Novel soluble triazoleimide oligomers terminated with arylacetylene terminated were synthesized by the Cu(I)-catalysed 1,3-dipolar cycloaddition polymerization of diazides and imide-containing dialkyne. Several molecular weight triazoleimide oligomers were prepared from diazide and dialkyne monomers with different stoichiometric combinations. The curing behaviors of the oligomers were tested by differential scanning calorimetry (DSC). The thermal properties of the cured products were evaluated by DSC and thermogravimetric analysis (TGA). These cured oligomers showed the glass transition temperature of about 225 -235 o C and the decomposition temperature (at 5% weight loss) of about 385 -393 o C in nitrogen.

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“…Many investigators have utilized a variety of analytical methods to examine the imidization and/or cure of ethynylor phenylethynyl-terminated imide polymers, including, for example, FTIR [19,24,35], DSC [19,23,36], thermogravimetric analysis (TGA) [23], high performance liquid chromatography (HPLC) [4], and solid-state 13 C nuclear magnetic resonance (NMR) [37] methods. Nonetheless, each of the approaches has limitations.…”

Section: Imidization and Cure Reaction Of Peti-5 Impregnated Glass Famentioning

confidence: 99%

Phenylethynyl-terminated polyimide, exfoliated graphite nanoplatelets, and the composites: an overview

Cho

Drzal²

2016

Carbon letters

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In efforts to characterize and understand the properties and processing of phenylethynylterminated imide (LaRC PETI-5, simply referred to as PETI-5) oligomers and polymers as a high-temperature sizing material for carbon fiber-reinforced polymer matrix composites, PETI-5 imidization and thermal curing behaviors have been extensively investigated based on the phenylethynyl end-group reaction. These studies are reviewed here. In addition, the use of PETI-5 to enhance interfacial adhesion between carbon fibers and a bismaleimide (BMI) matrix, as well as the dynamic mechanical properties of carbon/BMI composites, are discussed. Reports on the thermal expansion behavior of intercalated graphite flake, and the effects of exfoliated graphite nanoplatelets (xGnP) on the properties of PETI-5 matrix composites are also reviewed. The dynamic mechanical and thermal properties and the electrical resistivity of xGnP/PETI-5 composites are characterized. The effect of liquid rubber amine-terminated poly(butadiene-co-acrylonitrile) (ATBN)-coated xGnP particles incorporated into epoxy resin on the toughness of xGnP/epoxy composites is examined in terms of its impact on Izod strength. This paper provides an extensive overview from fundamental studies on PETI-5 and xGnP, as well as applied studies on relevant composite materials.Key words: polyimide, exfoliated graphite nanoplatelets, carbon fiber, composite, properties Phenylethynyl-Terminated Imide PolymerPolyimides have been extensively used in the electronics industry [1] as coatings, films, or adhesives and also in composite applications [2] as a primary or secondary structural material. When incorporated with organic or inorganic fibers, including carbon fibers and glass fibers, they can potentially be applied as a sizing material for high-temperature uses. In advanced applications, one of the most desirable advantages of polyimides, especially the aromatic polyimides, is their excellent high-temperature performance. Their thermal characteristics, including high temperature stability and cure behavior, are critical to successful processing and to the final properties of the resulting polyimide. For aerospace and aircraft applications, advanced polymer materials must successfully maintain their properties at high service temperatures over a long exposure time [3][4][5].The important parameters influencing the heat resistance of a polymeric material are its glass transition temperature (T g ), melting point (T m ), thermal stability, and etc., which may depend on its thermal history. Accordingly, polymers that are used to fulfill such high temperature performance should exhibit a high T g or T m and have excellent thermal stability. Even though some polyimides meet the high temperature requirement, their uses have been limited due to processing difficulties, such as poor solubility in common solvents, the release of volatiles, brittleness, and high processing temperature [6,7].Aromatic polyimides, especially acetylene or ethynyl-terminated polyimides, have been extensiv...

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A study of the thermal cure of a phenylethynyl‐terminated imide model compound and a phenylethynyl‐terminated imide oligomer (PETI‐5)

Cited by 27 publications

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On‐line Monitoring of Polymerization and Cure

On‐line Monitoring of Polymerization and Cure

Synthesis and Characteristic of Novel Soluble Triazoleimide Oligomers with Terminated Arylacetylene

Phenylethynyl-terminated polyimide, exfoliated graphite nanoplatelets, and the composites: an overview

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