A study on measurement and simulation for the propagation characteristics of through‐hole

Abstract

With the recent rapid advance in electronic technology, electronic components have become smaller, lighter and higher in performance. In connection with this trend, there has been increased use of the high frequencies due to increased speed of the devices. Under such situations, the interconnects between the electronic devices must be treated as strip lines. Especially, the through‐hole with a three‐dimensional structure indispensable for high‐density interconnects has nonnegligible effects on the circuits. Hence, the need for an analysis of its characteristics is acute. In this paper, to derive quantitative propagation characteristics of the through‐hole, a three‐dimensional electromagnetic field simulation of such a structure was carried out using the spatial network method and the results were compared with experimental data. It was confirmed that the simulated values of the time domain response and the frequency characteristics showed good quantitative agreement with the measured data. As a result, the validity of the simulation and the basic propagation characteristics of a through‐hole were confirmed.