A Study on the Cellphone Cover-Forming Process of Titanium Alloys Using the Finite Element Method

Abstract

In recent years, the style of 3C products demanded thin and small results due to gradual trends, though most of the industry is forming a continuous manner of stamping. However, the material thickness cannot be changed in products. This paper employs the rigid-plastic finite element (FE) DEFORMTM 3D software to investigate the plastic deformation behavior of titanium alloy (Ti-6Al-4V) workpiece for the forming processes of cellphone covers. In addition, this study utilizes the Solid Work 2010 3D graphics-rendering software for modeling, which is simulation software used to import various forming process conditions. The software analyzes the effective strain, the effective stress, critical damage value, and the die radius load distribution of the work-piece. Furthermore, this study used simulative software to analyze its forming processes for changes in grain size of the microstructure. The analytical results confirm the suitability of the current finite element software for forming processes of cellphone covers.