2024 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) 2024
DOI: 10.1109/sispad62626.2024.10733063
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A TCAD to SPICE Simulation Framework for Analysis of Device to Circuit BTI and HCD Aging: Invited Paper

Payel Chatterjee,
Karansingh Thakor,
Souvik Mahapatra
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