A TEM Study of the Effect of Accelerators on Pd‐Sn Colloidal Catalysts and on the Initiation of Electroless Cu Deposition on Epoxy

Horkans, Jean; Kim, Jungihl; McGrath, Colleen; Romankiw, L. T.

doi:10.1149/1.2100450

Cited by 43 publications

(38 citation statements)

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“…Direct transmission electron microscopy (TEM) through transparent epoxy samples was described in [21]. The substrate was a Si wafer having a number of Si3N4-covered windows.…”

Section: Experimental Methodsmentioning

confidence: 99%

“…Additionally, Matijevic et al [14] point out that the absence of light scattering from a solution does not prove the absence of a colloid. Osaka et al [20] and Horkans et al [21] have used electron microscopy to investigate the effect of different accelerators on the PdSn catalyst layer. Horkans et al [21] prepared thin epoxy samples for direct transmission electron microscopy on substrates chemically simEar to epoxy boards.…”

Section: Introductionmentioning

confidence: 99%

“…Osaka et al [20] and Horkans et al [21] have used electron microscopy to investigate the effect of different accelerators on the PdSn catalyst layer. Horkans et al [21] prepared thin epoxy samples for direct transmission electron microscopy on substrates chemically simEar to epoxy boards. Grunwald et al [22] used Auger electron spectroscopy to characterize the steps of activation and acceleration.…”

Section: Introductionmentioning

confidence: 99%

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Characterization of PdSn catalysts for electroless metal deposition

et al. 1988

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A set of electrochemical techniques has been developed to measure the component concentrations and the catalytic activity of the PdSn seeder solutions used to activate insulating substrates for the electroless deposition of Cu. The concentration of Sn(ll) was calculated from the limiting current for Sn(ll) oxidation, that of Sn(IV) from the difference between the Sn metal-deposition limiting current and the Sn(ll) limiting current. The palladium concentration was determined by a stripping analysis after Pd deposition from an oxidized seeder solution. The catalytic activity of the PdSn catalyst was estimated by measuring its activity for the electro-oxidation of formaldehyde (the reducing agent used in the electroless Cu bath) or by the cyclic voltammetric response of a seeded electrode in an inert electrolyte. The cyclic voltammetric technique and transmission electron microscopy examination were used to evaluate various accelerating solutions used to increase the activity of the seeder.

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“…Direct transmission electron microscopy (TEM) through transparent epoxy samples was described in [21]. The substrate was a Si wafer having a number of Si3N4-covered windows.…”

Section: Experimental Methodsmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Characterization of PdSn catalysts for electroless metal deposition

et al. 1988

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“…In the latter case [31][32][33], the oxidized substrate surface is directly activated by immersion in a colloidal solution obtained from an acidic mixture of tin chloride and palladium chloride. A further treatment (acceleration step) is still needed to allow the catalyst to be efficient.…”

Section: Electroless Depositionmentioning

confidence: 99%

Selective Metal Pattern Fabrication Through Micro-Contact or Ink-Jet Printing and Electroless Plating onto Polymer Surfaces Chemically Modified by Plasma Treatments

Bessueille

Gout

Cotte

et al. 2009

The Journal of Adhesion

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Simple versatile processes combining plasma treatments, micro-contact printing (mCP) or ink-jet printing (IJP), and electroless deposition (ELD) have been developed to produce micrometer and sub-micrometer scale metal (Ni, Ag) patterns at the surface of polymer substrates. Plasma treatments were mainly used to graft the substrate surfaces with either nitrogen-containing functionalities on which a palladium-based catalyst can be subsequently chemisorbed (case of Ni deposition through a tin-free process in solution) or oxygen-containing functionalities on which a tin-based sensitization agent can be subsequently chemisorbed (case of Ag deposition through a redox reaction). mCP of the catalyst or of self-assembled monolayers (SAMs) as well as ink printing were used to obtain locally active or non-active areas at the polymer surfaces. The metal micro-patterns were characterized using optical microscopy, scanning electron microscopy (SEM), and atomic force microscopy (AFM). Surface chemical characterization was carried out by X-ray photoelectron spectroscopy (XPS).

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“…[1][2][3][4][5] The conventional techniques of catalyzation are the two-step process consisting of sensitization with SnCl 2 /HCl followed by acceleration with PdCl 2 /HCl solution, and the one-step process which involves dipping the substrate in a colloid containing Pd/Sn salts. The entire substrate is catalyzed and photolithography or photomasks are used to activate a selected portion of the substrate.…”

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confidence: 99%

Tapping Mode Atomic Force Microscopy Analysis of a Novel Catalyzation Technique on Nonconducting Substrates

Kuruganti

1999

Electrochem. Solid-State Lett.

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A novel catalyzation technique involving direct printing of catalyst patterns on a nonconducting polymer substrate followed by thermal activation is investigated. The effects of time and temperature of activation on the nature and distribution of catalyst particles on the substrate was studied quantitatively using tapping mode atomic force microscopy (TMAFM). The TMAFM results indicate that a minimum amount of energy (integral of time and temperature) of activation were to be maintained for the initiation of catalyst particle formation on the nonconducting substrate.

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A TEM Study of the Effect of Accelerators on Pd‐Sn Colloidal Catalysts and on the Initiation of Electroless Cu Deposition on Epoxy

Cited by 43 publications

References 2 publications

Characterization of PdSn catalysts for electroless metal deposition

Characterization of PdSn catalysts for electroless metal deposition

Selective Metal Pattern Fabrication Through Micro-Contact or Ink-Jet Printing and Electroless Plating onto Polymer Surfaces Chemically Modified by Plasma Treatments

Tapping Mode Atomic Force Microscopy Analysis of a Novel Catalyzation Technique on Nonconducting Substrates

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