2016
DOI: 10.1063/1.4939905
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Abnormal positive bias stress instability of In–Ga–Zn–O thin-film transistors with low-temperature Al2O3 gate dielectric

Abstract: Low-temperature atomic layer deposition (ALD) was employed to deposit Al 2 O 3 as a gate dielectric in amorphous In-Ga-Zn-O thin-film transistors fabricated at temperatures below 120 C. The devices exhibited a negligible threshold voltage shift (DV T) during negative bias stress, but a more pronounced DV T under positive bias stress with a characteristic turnaround behavior from a positive DV T to a negative DV T. This abnormal positive bias instability is explained using a two-process model, including both el… Show more

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Cited by 66 publications
(52 citation statements)
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“…However, it increases more pronouncely after PBS in the IGZO TFT under mechanical bending stress than that at the flat state. In previous reports, the negative shift of V TH after a long stress time was mainly attributed to the hydrogen diffusion from a low-temperature ALD Al 2 O 3 gate dielectric into an IGZO layer [28]. As the hydrogen acts as an effective donor in IGZO, it generates the donor states near E C and shifts the V TH of the IGZO TFT in the negative direction.…”
Section: Resultsmentioning
confidence: 98%
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“…However, it increases more pronouncely after PBS in the IGZO TFT under mechanical bending stress than that at the flat state. In previous reports, the negative shift of V TH after a long stress time was mainly attributed to the hydrogen diffusion from a low-temperature ALD Al 2 O 3 gate dielectric into an IGZO layer [28]. As the hydrogen acts as an effective donor in IGZO, it generates the donor states near E C and shifts the V TH of the IGZO TFT in the negative direction.…”
Section: Resultsmentioning
confidence: 98%
“…V TH shifts in the positive direction during the initial 500 s; but shifts in the negative direction after 500 s of stress. In previous works, the PBS-induced V TH turnaround behavior was already observed in IGZO TFTs with a low-temperature ALD Al 2 O 3 gate dielectric and was mainly ascribed to the effect of electron trapping and hydrogen release and diffusion [28]. The positive shift of V TH at the initial stage of PBS was explained by the electron trapping in traps at the Al 2 O 3 /IGZO interface or bulk Al 2 O 3 , and the negative shift of V TH after a long stress time was mainly attributed to the hydrogen diffusion from a low-temperature ALD Al 2 O 3 gate dielectric into an IGZO layer.…”
Section: Resultsmentioning
confidence: 99%
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“…The abnormal shift in V T when applying PBS is associated to the hydrogen release from residual AlO-H bonds in the AlO x gate dielectric and their migration to the IGZO channel. By diffusing the hydrogen atoms in the channel, a negative Δ V T is induced through electron doping power-law time dependence [42]. Initially V T shifts abruptly however after 30 min the devices stabilize with maximum Δ V T = −0.22 V after 1 h of PBS.…”
Section: Resultsmentioning
confidence: 99%
“…Thus, in the proposed device, vertical gate voltage has the controllability over the hydrogen ions which are weakly bound to AlO and easy to break the bond and move as shown in Fig. 4(a) [22]. This operation provides the modulation of channel conductance which can be inferences as synaptic weight, by which the biological analogy to change in strength of synaptic connectivity schematically shown in Fig.…”
Section: Theoretical Backgroundmentioning
confidence: 97%