Accurate modeling and simulation of SAW RF filters

Pitschi, F.M.; Kiwitt, J.E.; Ruppel, C.C.W.; Wagner, K.

doi:10.1109/mwsym.2003.1210554

Cited by 18 publications

(6 citation statements)

References 10 publications

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“…There are neither intentionally nor unintentionally artifacts included in the test setup (e.g., the sample printed circuit board (PCB)) or the application setup (e.g., PCB of wireless terminal). The measurements throughout the whole paper have been obtained using neutral PCBs, the electrical properties of which have been optimized in order to yield (a) minimal reflections, (b) minimal feed-through or cross-talk, and (c) minimal losses over the complete signal paths from the SMA connectors to the landing areas of the footprint [14], [15], [16].…”

Section: A Neutral Measurement Setupmentioning

confidence: 99%

High performance microwave acoustic components for mobile radios

Pitschi¹,

Kiwitt²,

Koch³

et al. 2009

2009 IEEE International Ultrasonics Symposium

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Due to their outstanding characteristics acoustic components, such as SAW and -later on -also BAW filters, have been key components in wireless communication systems from their very beginning. Regarding mobile radio handsets the primary field of application of acoustic components has moved to the RF front-end sections. Here, with the increasing demand for WCDMA-FDD capable mobile phones, duplexers, which allow to separate the TX and RX paths while being simultaneously connected to the antenna, have become indispensable.Regarding the specifications of the different operating bands the requirements on form factors, pass band characteristics, attenuations of the other signals (TX, RX, GPS, WLAN, . . . ), and isolations make them high performance components requiring a sophisticated acoustic as well as electromagnetic design. Due to the tough requirements imposed on the duplexers in terms of, e.g., center frequencies, spacings of RX and TX bands, relative band widths, and shape factors, they also require application-specific acoustic structures.As a consequence, in contrast to standard filters, duplexers are highly optimized components using leading-edge technologies. In order to achieve the best balance of the characteristic properties of the acoustic structures regarding, for instance, their quality factors, pole-zero distances, and temperature coefficients, the manufacturing processes of the acoustic chips are designed for the specific applications. Furthermore, optimizing the electrical characteristics a co-design of package and acoustic chip is applied.In this paper we provide an overview of the different types of duplexers that have been the result of the focused specialization and optimization efforts. We classify them according to the type of acoustic structures, matching circuitry, and package being used. So far, purely SAW-based and BAW-based duplexers as well as hybrid duplexers using both SAW and BAW chips have been reported. Most of the matching circuitry is integrated in, for instance, an LTCC package using a distributed approach based on a λ/4 line or a lumped approach comprising coils and/or capacitors. Sometimes the matching circuitry is realized externally on the PCB. Furthermore, we present recent integration successes, i.e., duplexer inserts, allowing the seamless integration of duplexers into modules without drawbacks on performance or module thickness.

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Section: A Neutral Measurement Setupmentioning

confidence: 99%

High performance microwave acoustic components for mobile radios

Pitschi¹,

Kiwitt²,

Koch³

et al. 2009

2009 IEEE International Ultrasonics Symposium

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“…To the pure acoustic simulation is added the electromagnetic simulation of the layout of the die and of the carrier as indicated in [11]. The impact of the layout and carrier can then be accurately estimated at the design stage.…”

Section: E Layout and Package Em Simulationmentioning

confidence: 99%

Very low amplitude ripple SAW filter for infrastructure systems using 41°Y-X lithium niobate: Full FEM/BEM design approach

Chamaly¹,

Fong²,

Perois³

et al. 2009

2009 IEEE International Ultrasonics Symposium

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High data rate communication devices demand high relative bandwidth and therefore wide band filters are necessary. In infrastructure systems like base stations and microwave radiolinks, such filtering function was carried out by ceramic filter technology. They were preferred for their low in-band ripple and VSWR necessary for low EVM and amplifier linearity. We have developed a design technique allowing SAW devices to advantageously replace ceramic filters in many systems.One important parameter that determines the performance of a piezoelectric device is the electromechanical coupling coefficient. RF filters designed on widely used 42°Y-X LiTaO 3 are not meeting the stringent specification requested by infrastructure systems. To increase the width of the bandwidth and reduce the in-band ripple, a material with high electromechanical coupling coefficient is needed. This paper describes the search for the optimal working point using a full FEM/BEM approach and proposes a new design technique on 41°Y-X LiNbO 3 . This technique is applied to high reliability RF filters. On 41°Y-X LiNbO 3 , bandwidths larger than 8% at 3dB attenuation are achieved leading to very low amplitude ripple. A GSM Rx filter for base station at 1747.5MHz is demonstrated. Filter bandwidth is 140MHz leading to ripple in the frequency band 1710MHz to 1785MHz being lower than 0.2dB nominal and 1dB over temperature and total 6 sigma manufacturing. Insertion loss is 2.5dB while image rejection is better than 45dB. Size is 3x3mm 2 in a high reliability ceramic cavity package.The close correspondence between simulation and measurement demonstrates the ability of our methodology to design SAW devices rapidly and accurately on virtually any material. The filters designed by this technique on 41°Y-X LiNbO 3 are demonstrating a wide band and very low in-band ripple perfectly matching the infrastructure systems requirement.

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“…Furthermore, these models are static without relevant dependencies [11]. Recently, electromagnetic simulation tools were successfully used in package modeling [11]- [14]. For duplexers, a key specification is the rejection that has to reach 60 dB levels.…”

Section: Full-wave Analysis Of Duplexer Packagementioning

confidence: 99%

Design of miniaturized RF SAW duplexer package

Dong

Cheema³

et al. 2004

IEEE Trans. Ultrason., Ferroelect., Freq. Contr.

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This paper provides a comprehensive methodology for accurate analysis and design of miniaturized radio frequency (RF) surface acoustic wave (SAW) duplexer package. Full-wave analysis based on the three dimensional (3-D) finite element method (FEM) is applied to get the package model. The die model is obtained by combining the parasitics and acoustics models. The modeling of bonding wire is also discussed. The models of package, die, and bonding wires are assembled together to get the total response. Based on this methodology, several novel ideas are proposed to significantly improve the isolation. Simulation and measurement results are compared, and excellent agreement is found. The technique developed in this paper reduces the design cycle time greatly and can be applied to various RF SAW device packages.

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Accurate modeling and simulation of SAW RF filters

Cited by 18 publications

References 10 publications

High performance microwave acoustic components for mobile radios

High performance microwave acoustic components for mobile radios

Very low amplitude ripple SAW filter for infrastructure systems using 41°Y-X lithium niobate: Full FEM/BEM design approach

Design of miniaturized RF SAW duplexer package

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