Adhesion improvement for solder interconnection of wet chemically coated aluminum surfaces

Rose, Angela De; Kamp, Mathias; Mikolasch, Gabriele; Kraft, Achim; Nowottnick, Mathias

doi:10.1063/1.5125879

Cited by 3 publications

(2 citation statements)

References 11 publications

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“…The wet chemical coating (Zn treatment and electroless Ni plating) has been widely reported in literature and can be easily executed on inline or batch tools. 11,15,17,21,34 For a higher throughput for the investigated coating in this work, the Ni plating time could be further reduced, depending on the quality of the Zn layer and the desired Ni thickness. Since the soldering time is really short (<5 s), the used solder alloy has to be eutectic or even near-eutectic to ensure fast and homogeneous liquidation and solidication.…”

Section: Discussionmentioning

confidence: 99%

Microstructure and long-term stability of solder joints on nickel-plated aluminium formed during short soldering times

et al. 2020

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Section: Discussionmentioning

confidence: 99%

Microstructure and long-term stability of solder joints on nickel-plated aluminium formed during short soldering times

et al. 2020

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“…Furthermore, the adhesive technologies have found extensive use in wide range of practically important application areas, for example, in robotics [1][2][3] and medicine [4,5]. The adhesive properties of contacting surfaces play a decisive role in such common technological processes as painting [6,7], soldering [8,9], welding [10,11], gluing surfaces [12,13], coatings [14], etc. The surface roughness partially prevents the creation of good contact [15,16], and as a result, adhesion often does not manifest itself.…”

Section: Introductionmentioning

confidence: 99%

Modeling Density Waves and Circulations in Vertical Cross-Section in Adhesive Contacts

Filippov,

Lyashenko,

Popov

2024

Computation

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This work continues the study of the process of friction between a steel spherical indenter and a soft elastic elastomer previously published in our paper. It is done in the context of our previous experimental results obtained on systems with strongly pronounced adhesive interaction between the surfaces of contacting bodies during the process of friction between a steel spherical indenter and a soft elastic elastomer. In the present paper, we concentrate on the theoretical study of the processes developing in a vertical cross-section of the system. For continuity, here the case of indenter motion at a low speed at different indentation depths is considered as before. The analysis of the evolution of normal and tangential contact forces, mean normal pressure, tangential stresses, as well as the size of the contact area is performed. Despite its relative simplicity, a numerical two-dimensional (2D = 1 + 1) model, which is used here, satisfactorily reproduces experimentally observed effects. Furthermore, it allows direct visualization of the motion in the vertical cross-section of the system, which is currently invisible experimentally. Partially, it recalls two-dimensional (2D = 1 + 1) models recently proposed to describe the “turbulent” shear flow of solids under torsion and in cellular materials. The observations extracted from the model help us to understand better the adhesive processes that underlie the experimental results.

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Summary of the 8th Workshop on Metallization and Interconnection for Crystalline Silicon Solar Cells

Beaucarne¹,

Schubert

Tous

et al. 2019

International Symposium on Green and Sustainable Technology (Isgst2019)

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Adhesion improvement for solder interconnection of wet chemically coated aluminum surfaces

Cited by 3 publications

References 11 publications

Microstructure and long-term stability of solder joints on nickel-plated aluminium formed during short soldering times

Microstructure and long-term stability of solder joints on nickel-plated aluminium formed during short soldering times

Modeling Density Waves and Circulations in Vertical Cross-Section in Adhesive Contacts

Summary of the 8th Workshop on Metallization and Interconnection for Crystalline Silicon Solar Cells

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