Advanced Devices and Electronic Packaging for Harsh Environment

Abstract

The paper addresses the challenges in electronic packaging for extreme environment based on experimental work of the researchers and conducted reliability testing to evaluate high speed devices suitable for these applications, substrates, die attach, wire bonding, and encapsulation and housing. In particular, the researcher's work has focused on SiC power devices with low loss high voltage Schottky diodes with significant applications, high temperature JFETs and SiC MOSFETs (double trench), and GaN microwave devices. The paper provides recommendations for selection of devices, substrates, die attach, and encapsulation and housing for these applications.