Advanced fault localization techniques in microelectronics failure analysis

Abstract

Failure analysis (FA) plays an important role in semiconductor industry as the process technology and new packaging are continuously improved. Fault localization is a key step to narrow down the area of failed part and isolate the defective areas, which is prior to destructive failure analysis. This paper will cover some advanced fault localization techniques and tools in package and die/device level failure analysis. Case studies for those techniques will provide a good understanding and illustrate the applications.