Advanced VRM Incorporated with 3D DCB Package for Computor Power Management Applications

Abstract

This paper proposed a voltage regulator module (VRM) integrated with 3D Direct Copper Bonded (DCB) packaging technology for advanced computation applications. Technical analysis has been undertaken to investigate the multifaceted features of existing technologies in a computer system. Addressing on the technology challenges, i.e. parasitic effect and overheating issues, a 3D DCB packaged VRM is developed in this work. Its configuration is designated to improve the effectiveness in mitigating both issues, and the results are subsequently evaluated by multiphysics simulation. The results show the internal parasitic inductance of VRM has been reduced to 0.19nH in contrast to the 10nH of conventional approaches, and the 3D package leads to improved cooling efficiency for computer power management applications.