2019 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD) 2019
DOI: 10.1109/sispad.2019.8870543
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Advances in 3D CMOS image sensors optical modeling: combining realistic morphologies with FDTD

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“…The simulation takes into account the full optical stack and the metal reflector at the front of the device (at the contact side in figure 1). Details of the optical simulation can be found in [30]. The outcome of the simulation is an overall of 26% of the incoming photon to be absorbed within the volume of the device, for this architecture.…”
Section: Results and Comparisons With Experimentsmentioning
confidence: 99%
“…The simulation takes into account the full optical stack and the metal reflector at the front of the device (at the contact side in figure 1). Details of the optical simulation can be found in [30]. The outcome of the simulation is an overall of 26% of the incoming photon to be absorbed within the volume of the device, for this architecture.…”
Section: Results and Comparisons With Experimentsmentioning
confidence: 99%