2013
DOI: 10.7567/jjap.52.052101
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Ag/Ni/Ag Multilayer Reflector for GaN-Based Vertical Light-Emitting Diode

Abstract: We investigate the effect of Ni insertion on the electrical and thermal properties of Ag-based reflectors for GaN-based light emitting diodes (LEDs). It is shown that after annealing at 500 °C, the surface of Ag only sample becomes significantly roughened due to agglomeration, whereas the surface of Ni-inserted Ag sample get roughened with elongated Ag hillocks on an ∼100-nm-thick Ag film. The Ni-inserted Ag contacts show higher reflectance (at 460 nm) than the Ag only sample after annealing at 500 °C. The 500… Show more

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Cited by 8 publications
(6 citation statements)
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“…Improving the light extraction efficiency is vital for the development of HB LEDs. One of the methods is to reduce the light scattering by depositing a highly reflective silver (Ag) thin film on the lead frame surface [3][4][5][6][7][8]. The Ag layer also serves the purpose of enhancing the solderability and heat dissipation of the lead frame.…”
Section: Introductionmentioning
confidence: 99%
“…Improving the light extraction efficiency is vital for the development of HB LEDs. One of the methods is to reduce the light scattering by depositing a highly reflective silver (Ag) thin film on the lead frame surface [3][4][5][6][7][8]. The Ag layer also serves the purpose of enhancing the solderability and heat dissipation of the lead frame.…”
Section: Introductionmentioning
confidence: 99%
“…Temperature-dependent optical properties show that these films can preserve their high reflectivity at high temperatures. Record-high reflectivity, large mechanical hardness, structural and thermal stability, high melting temperatures, and CMOS compatibility make HfN and ZrN attractive alternative materials for solar mirrors in photovoltaics, 57 heatassisted magnetic recordings, 58 high-brightness light-emitting diode (LED) devices, 59 and passive daytime radiative cooling applications. 60…”
Section: ■ Conclusionmentioning
confidence: 99%
“…On the other hand, Ag suffers thermal instability, such as agglomeration at temperatures above 300 °C . For this reason, many studies have been performed to overcome the agglomeration of Ag that is related to thermal degradation, such as Ag‐based alloys , interlayers , and inserted layers . For example, Ag‐based alloys, such as AgAl and AgCu alloys, effectively improved the thermal stability of Ag films.…”
Section: Introductionmentioning
confidence: 99%