Alternative architectures for video signal processing

Wolf, Wayne

doi:10.1109/iwv.2000.844521

Cited by 94 publications

(132 citation statements)

References 6 publications

Supporting

Mentioning

129

Contrasting

Order By: Relevance

“…Photolithography typically relies on the transfer of opaque geometries patterned on a clear mask by projecting ultraviolet (UV) or X-ray light through the mask onto a photosensitive poly mer (known as photoresist or PR). [ 30 ] The resolution of photolithography is limited by the wavelength of the light according to…”

Section: Interference Lithographymentioning

confidence: 99%

Engineering of Micro‐ and Nanostructured Surfaces with Anisotropic Geometries and Properties

Tawfick¹,

Volder²,

Copic³

et al. 2012

Advanced Materials

216

179

View full text Add to dashboard Cite

Widespread approaches to fabricate surfaces with robust micro- and nanostructured topographies have been stimulated by opportunities to enhance interface performance by combining physical and chemical effects. In particular, arrays of asymmetric surface features, such as arrays of grooves, inclined pillars, and helical protrusions, have been shown to impart unique anisotropy in properties including wetting, adhesion, thermal and/or electrical conductivity, optical activity, and capability to direct cell growth. These properties are of wide interest for applications including energy conversion, microelectronics, chemical and biological sensing, and bioengineering. However, fabrication of asymmetric surface features often pushes the limits of traditional etching and deposition techniques, making it challenging to produce the desired surfaces in a scalable and cost-effective manner. We review and classify approaches to fabricate arrays of asymmetric 2D and 3D surface features, in polymers, metals, and ceramics. Analytical and empirical relationships among geometries, materials, and surface properties are discussed, especially in the context of the applications mentioned above. Further, opportunities for new fabrication methods that combine lithography with principles of self-assembly are identified, aiming to establish design principles for fabrication of arbitrary 3D surface textures over large areas.

show abstract

Section: Interference Lithographymentioning

confidence: 99%

Engineering of Micro‐ and Nanostructured Surfaces with Anisotropic Geometries and Properties

Tawfick¹,

Volder²,

Copic³

et al. 2012

Advanced Materials

216

179

View full text Add to dashboard Cite

show abstract

“…Among installed photovoltaic systems, more than 90% are mono-and polycrystalline silicon cells, which provide the advantages of low cost and large area with relatively high efficiency [1]. Cleaning the surfaces of silicon wafers is one of the most critical operations in device processing technologies [2], in particular, in the photovoltaic industry.…”

Section: Introductionmentioning

confidence: 99%

Water‐based sonochemical cleaning in the manufacturing of high‐efficiency photovoltaic silicon wafers

Nadtochiy

Podolian

Korotchenkov

et al. 2011

Phys. Status Solidi C

View full text Add to dashboard Cite

We found that organic particle contaminants are effectively removed during ultrasonic cleaning in distilled water, as evidenced by the disappearance of organic‐related absorption peaks and remarkable shortening of the surface photovoltage decay transients (SPV). SPV decay transient mappings obtained with a 100‐μm spatial resolution (see abstract figure) show that, in multicrystalline Si wafers, the resulting effect on the decay time is markedly non‐uniform compared with that observed in crystalline Si, implying the existence of a mechanism associated with the grain boundaries. The data are tentatively interpreted in terms of the wafer hydrogenization, which most probably occur through the grain boundaries. It is assumed that elevated temperatures inside a cavitating bubble may lead to water and bubble gas decomposition, accompanied by a subsequent trapping of the decomposed particulates at the silicon surface. These particulates can then be predominantly incorporated into the grain boundary regions. We suggest that this can be in part due to hydrogen molecules decomposed in water which are mobile in silicon (© 2011 WILEY‐VCH Verlag GmbH & Co. KGaA, Weinheim)

show abstract

“…Tantalum is used in the semiconductor industry as a barrier layer to prevent diffusion of copper metallization into silicon dioxide and silicon 9 . It was suggested 10 that it might function as a barrier between Cu and ZnSe or ZnS preventing any chemical reaction at the interface.…”

Section: Resolution Of the Discrepancy And Possible Solutionsmentioning

confidence: 99%

Reflective coating for near-infrared immersion gratings

Kuzmenko

Ikeda²,

Kobayashi

et al. 2012

SPIE Proceedings

View full text Add to dashboard Cite

Achieving high reflectivity from an immersed grating facet can be challenging in the near infrared. The reflectivity of metallic coatings in common use, such as Al and Cr/Au, decrease with decreasing wavelength in the near IR. A layer of copper on ZnSe or ZnS should have a high, immersed reflectivity based on tabulated values of refractive index, but in fact performs poorly. We attribute this to a chemical reaction between the copper and the selenium or sulfur.A non-reactive intermediate layer can prevent this problem. Since reflectivity at an interface increases with increasing difference in refractive index, it is beneficial to choose an intermediate layer of low index. A further improvement is gained by adjusting the layer thickness so that reflections from the two interfaces of the intermediate layer add constructively.We sputtered 130 nm of SiO 2 onto ZnSe and ZnS substrates followed by 200 nm of Cu. The copper was then coated with 5 nm of SiC as a protective capping layer. Immersed reflectivity measured shortly after coating exceeded 95% between 1500 and 1100 nm and exceeded 90% down to 850 nm. A repeat measurement after long term exposure to high humidity conditions showed no changes.

show abstract

Alternative architectures for video signal processing

Cited by 94 publications

References 6 publications

Engineering of Micro‐ and Nanostructured Surfaces with Anisotropic Geometries and Properties

Engineering of Micro‐ and Nanostructured Surfaces with Anisotropic Geometries and Properties

Water‐based sonochemical cleaning in the manufacturing of high‐efficiency photovoltaic silicon wafers

Reflective coating for near-infrared immersion gratings

Contact Info

Product

Resources

About