&amp;#x201C;Optical electronic data transfer technical gaps, needs and non-needs extracted from industry Roadmaps (iNemi, ITRS and the MIT CTR)&amp;#x201D;

Otte, Richard F.

doi:10.1109/oic.2013.6552912

Cited by 2 publications

(1 citation statement)

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“…These drawbacks are however slowly fading away owing to recent progress in commercially available optoelectronic components, optical waveguide materials and new process techniques. In the meantime, the channel speeds in current communication systems have past the point of 10 Gbit/s and is currently in a research context scaling up to 25 Gbit/s and more, at which electromagnetic interference is limiting the use and the density of electrical interconnections [1].…”

Section: Rationalementioning

confidence: 99%

Assembly of optoelectronics for efficient chip-to-waveguide coupling

Bosman

Kaur

Missinne

et al. 2013

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)

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This paper presents two solutions to achieve efficient optical coupling between vertical cavity surface emitting lasers and planar optical waveguides, by minimizing the free space optical path length. One approach is based on embedding of optoelectronic chips in polymer layers, and the other approach on flip-chip assembly using micro-bumps. These micro-bumps are defined by laser-induced-forwardtransfer (LIFT), a technique in which the bumping material can be transfered from a donor carrier to the waveguiding substrate. In both cases, out-of-plane bending of the light is accomplished by using a 45 degrees micro-mirror interface.

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Section: Rationalementioning

confidence: 99%

Assembly of optoelectronics for efficient chip-to-waveguide coupling

Bosman

Kaur

Missinne

et al. 2013

2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013)

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Polymer integration of optoelectronic devices in on-board and board-to-board optical communication systems

Bosman

Hoe

Missinne

et al. 2014

Optical Interconnects XIV

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This paper demonstrates a combined packaging and optical coupling scheme for optoelectronic devices in short distance optical communication systems. The proposed scheme allows an ultra short optical path between the optoelectronic component and the optical waveguide entry. This is achieved by embedding the bare die optoelectronics in the substrate of the optical system. The positioning and alignment of the embedded dies is performed with a scalable passive alignment process based on physical alignment studs which are manufactured with standard photolithography combined with the use of Moiré interference patterns for precise alignment

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“Optical electronic data transfer technical gaps, needs and non-needs extracted from industry Roadmaps (iNemi, ITRS and the MIT CTR)”

Abstract: Optical data transmission applications emerging from the Roadmaps; raising Telecom bandwidth efficiency, the role for PICs; microprocessor IO Bandwidth density and optical interposers; data center power reduction; optical backplanes; on-chip interconnect.

Cited by 2 publications

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Assembly of optoelectronics for efficient chip-to-waveguide coupling

Assembly of optoelectronics for efficient chip-to-waveguide coupling

Polymer integration of optoelectronic devices in on-board and board-to-board optical communication systems

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