2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and 2022
DOI: 10.1109/eurosime54907.2022.9758866
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An advanced, systematic simulation approach for studying warpage drivers of an assembled printed circuit board in early development stage

M. Frewein
1
,
Srdjan Stojanović
2
,
Tao Qi
3
et al.
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Cited by 6 publications
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References 13 publications
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Material Characterization and Modelling for FE-Based Reliability Assessment of PCBs and Electronic Systems

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et al. 2024
Recent Advances in Microelectronics Reliability
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Material Characterization and Modelling for FE-Based Reliability Assessment of PCBs and Electronic Systems

Frewein,
Krivec,
Ortner
et al. 2024
Recent Advances in Microelectronics Reliability
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Prediction of thermo-mechanical properties of PCB conductive layers using convolutional neural networks

Shevchuk
1
,
Schipfer
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,
Haselmann
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et al. 2023
2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and
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A comprehensive methodology for criticality assessment of microvias in printed circuit board assemblies

Kamble,
Patel,
Schipfer
et al. 2024
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and
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