An analysis of low complexity of 5G-MIMO communication system based CR using hybrid filter detection

Analyses Hybrid Technique Detection Multiple Input Multiple Output 5G Waveforms

“…Additionally, an algorithm for simulating the ED process based on SLC in MIMO-OFDM systems was proposed in [46], which analyzed the impact of false alarm on detection probability for various operating parameters in MIMO-OFDM communication systems. An in-depth analysis of the effect of MIMO transmissions on the ED process using the SLC technique in MIMO-OFDM systems has yet to be conducted, despite numerous issues being considered in related works [9,27,[36][37][38][39][40][41][42][43]. In this work, mathematical expressions defining the relationship between detection probability, false alarm probability, SNR, and the number of samples used for SLC-based ED in MIMO-UFMC systems were developed for the first time.…”

“…Additionally, ED has a poor level of performance when performing PU signal detection of signals below a certain signal-to-noise ratio (SNR) level referred to as the SNR wall. The inability to distinguish between a PU signal, SU signal, and interference is another disadvantage of ED methods [8][9][10][11][12][13][14]. The Energy Detector (ED) method is widely used in practice due to its simple implementation.…”

Filtered Ofdm System Model for Papr Reduction in the Growth Of 5g

“…The annual surge in data traffic within communication systems is accelerating at an unprecedented pace, propelling the imminent need for a nearly 1000-fold increase in capacity. The forthcoming era of 5G is poised as a potential savior, promising throughput in the realm of multiple gigabits per second to satiate this incessantly burgeoning demand [1]. Beyond merely quenching the thirst for higher data rates, 5G technology is envisioned to fortify reliable transmission and reception for the expanding array of devices tethered to networks.…”

Metallization of Polyamide-imide for High-Frequency Communication by Polyethylenimine Modification and Electroless Copper Plating

“…With the rapid progression of 5G communication technology, information processing has progressively advanced into the domain of high-frequency communication electronics and high-speed data transmission. − As the foundation of high-frequency communication, dielectric filters have garnered increasing attention toward cost-effective and range-massive communication electronics in the past few years. , Among the various types of dielectric filter substrates, polyamide-imide (PAI) substrates have been widely utilized in fields including radar reconnaissance, field communication, and communication base station, with advantages of smaller volume, lighter weight, better temperature adaptability, etc. − Up to now, various techniques such as burning infiltration silver, sputtering, and coating have been extensively investigated for the fabrication of conductive layers on PAI substrates. − Nevertheless, the high-temperature aging process of silver paste is time-consuming and energy-intensive. Meanwhile, the conventional sputtering process necessitates high-vacuum and voltage, which results in significant energy consumption. − Furthermore, the metallized PAI substrate prepared through coating typically results in a thick layer of copper, which cannot meet the requirements for ultrathin layers. − To achieve the metallization of substrates with superior adhesion, prospective metal thickness, and optimal cost-effectiveness, extensive research has been conducted on the process of electroless copper plating (ECP) onto the modified substrate surface. − As a well-established autocatalytic technique, electroless deposition is extensively utilized for the production of high-adhesion and low-resistivity metal layers on various types of materials, including polymer plastics, − papers, , ceramics, − and glasses. − Nevertheless, achieving strong adhesion between autocatalytic sites and smooth surfaces of PAI substrates without combinative functional groups or mechanical bonding points is full of challenges. −…”