Abstract:Future high-performance embedded and general purpose processors and systems-on-chip are expected to combine hundreds of cores integrated together to satisfy the power and performance requirements of large complex applications. As the number of cores continues to increase, the employment of low-power and high-throughput on-chip interconnect fabrics becomes imperative. In this work, we present a novel mesh-based photonic on-chip interconnect, named PHENIC-II, for future high-performance many-core systems. The no… Show more
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