An infrared journey

Abstract

Infrared focal plane array technology has evolved dramatically over the last 50 years. The author has been privileged to participate in this remarkable evolution, working totally within the confines of one of the most significant and remaining US players in the focal plane game, namely Texas Instruments, later to become DRS Technologies. This presentation describes a journey from the Common Module through second and third generation infrared systems in the USA up to the exciting developments of the present day ultra-small pixel technology. It represents an attempt to detail both the technology development of the time together with some of its associated drama as viewed from the author's particular perspective. Thoughts on the lessons learned from this journey and their possible impact on future technology development will be discussed.

TexSe1–x Photodiode Shortwave Infrared Detection and Imaging

“…[ 12 ] Alternatively, these infrared photodetectors can heterogeneously integrate with ROICs via wire bonding, indium solder bumps, or copper–copper bonding, giving rise to low image resolution. [ 13–16 ] However, the heterogeneous integration complicates the manufacturing process and decreases the product yield, thereby increasing the product cost. One medium‐quality InGaAs infrared chip costs as high as 600 USD, [ 17 ] two orders of magnitude higher than the normal silicon visual chip.…”