An investigation on mechanical random vibration fatigue damage of solder joints in electronic systems

Abstract

Purpose The purpose of this paper is to propose a method with capability of short-time implementation. Design/methodology/approach This paper was directed using both experimental tests and simulations to propose a comprehensive method for lifetime estimation of the solder joints. Findings A new method with good agreement with experimental tests has been proposed. Originality/value It is confirmed that paper is original.

Role of aging temperature on thermomechanical fatigue lifetime of solder joints in electronic systems

“…For quantitative comparison between the Morrow fatigue lifetime predictive model defined in equation (7) and the Wöhler fatigue lifetime predictive model defined in equation (5) and power-law fatigue predictive model defined in equation (3), an error analysis was carried out. In this regard, the introduced error indices (Feng et al , 2020), namely, integral absolute error and integral square error, were used. The experimental results and model predictions are listed in Table 3.…”