Analysis of coupling effects in waveguides using the BLT Equation and Numerical Methods

Du, Jin-Kyoung; Ahn, Jae-Woon; Hwang, Sun-Mook; Yook, Jong-Gwan

doi:10.1109/mwsym.2012.6259460

Cited by 4 publications

(2 citation statements)

References 2 publications

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“…Due to the complexity of modern electronic systems, this problem has been studied at various subsystem levels ranging from components [9,[12][13][14] and printed circuit boards (PCB) [15][16][17][18][19][20] to cables [21][22][23][24][25][26][27] and enclosures [15,[25][26][27][28][29][30], with some groups even consider-ing the system as a whole [31]. Furthermore, this problem is typically separated into four areas of study: coupling, energy distribution, device response, and system response.…”

Section: Introductionmentioning

confidence: 99%

A Study on the Radiated Susceptibility of Printed Circuit Boards and the Effects of Via Fencing

et al. 2021

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Because modern electronic systems are likely to be exposed to high intensity radiated fields (HIRF) environments, there is growing interest in understanding how electronic systems are affected by such environments. Backdoor coupling in particular is an area of concern for all electronics, but there is limited understanding about the mechanisms behind backdoor coupling. In this work, we present a study on printed circuit board (PCB) backdoor coupling and the effects of via fencing. Existing work focuses on ideal stackups and indicates that edge radiation is significantly reduced by via fencing. In this study, both full wave electromagnetic modeling and experimental verification are used to investigate both ideal and practical PCB stackups. In the ideal scenario, we find that via fencing substantially reduces coupling, which is consistent with prior work on emissions. In the practical scenario, we incorporate component footprints and traces which naturally introduce openings in the top ground plane. Both simulation and experimental data indicate that via fencing in the practical scenario does not substantially mitigate coupling, suggesting that PCB edge coupling is not the dominant coupling mechanism, even at varying angles of incidence and polarization.

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Section: Introductionmentioning

confidence: 99%

A Study on the Radiated Susceptibility of Printed Circuit Boards and the Effects of Via Fencing

et al. 2021

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“…apertures [3], [4]. Transmission characteristics are a function of various parameters such as the polarization, frequency, and incident direction of EM waves.…”

Section: Introductionmentioning

confidence: 99%

Electromagnetic Signature of a Quadcopter Drone and Its Relationship With Coupling Mechanisms

et al. 2019

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This paper presents an investigation of the electromagnetic signature and the coupling mechanism of quadcopter drones with incident electromagnetic (EM) wave and radar cross section (RCS) analysis. Coupling analysis is performed based on the dominant coupling path: when an incident EM wave with a magnitude of 50 kV/m contacts a commercial quadcopter drone, its motor power wires are identified as the dominant coupling path. Higher coupling voltages are obtained for frequencies that have large impedance values at both ends of the load on the motor power wire. This induced voltage can affect the integrated circuit chip on a printed circuit board, as well as parallel plate resonances. Furthermore, the RCS of a quadcopter drone is measured in the frequency range of 0.5-3 GHz. The internal-component vulnerability characteristics of quadcopters can spike at specific frequencies with high RCS values and can be analyzed with or without motor power wires. We verified these hypotheses via 2D inverse synthetic aperture radar images, and we analyzed the results by comparing the empirical and full-wave simulation values.INDEX TERMS Coupling analysis, input impedance, inverse synthetic aperture radar, parallel plate resonance, quadcopter drone, radar cross section, vulnerable path, wire coupling.

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Electromagnetic shielding effectiveness with multi-layered waveguide-below-cutoff array for improved air flow

Kim

Pang

et al. 2017

2017 IEEE Asia Pacific Microwave Conference (APMC)

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Analysis of coupling effects in waveguides using the BLT Equation and Numerical Methods

Cited by 4 publications

References 2 publications

A Study on the Radiated Susceptibility of Printed Circuit Boards and the Effects of Via Fencing

A Study on the Radiated Susceptibility of Printed Circuit Boards and the Effects of Via Fencing

Electromagnetic Signature of a Quadcopter Drone and Its Relationship With Coupling Mechanisms

Electromagnetic shielding effectiveness with multi-layered waveguide-below-cutoff array for improved air flow

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