Analysis of Die Compaction of Chip Geometry through Porous Continuum Model‐Based Approach

Abstract

Metal swarf has the advantage of being eco‐friendly due to their ability to be recycled and reused, in addition to being lightweight, energy‐absorbing, and cost‐effective. For practical applications in various industrial fields, effective and accurate modeling for each case should be developed in consideration of its physical properties. This study investigates the mechanical behavior of aluminum chip compaction employing a new computational simulation approach based on a pressure‐dependent porous continuum model. Two material parameters of densification rate (n) and ratio of shear modulus (m) were proposed and adjusted for different swarf. The numerical results show good agreement with the experimentally obtained axial stress – relative density relation of three various samples, demonstrating a close relationship between the parameters n and the chip geometry. This study can be applied for further investigation and analysis utilizing metal swarf of different geometries in various industrial applications.This article is protected by copyright. All rights reserved.