2015 IEEE 22nd International Symposium on the Physical and Failure Analysis of Integrated Circuits 2015
DOI: 10.1109/ipfa.2015.7224426
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Analysis of electromigration void nucleation failure time in open copper TSVs

Marco Rovitto
1
,
W. H. Zisser
2
,
H. Ceric
3
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Cited by 4 publications
(1 citation statement)
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“…In the FMECA, the entire system is examined on a functional level, and the effects of failures and malfunctions on the performance of the equipment are determined. The interface circuits of the various subsystems, on the other hand, are analysed at the component level [83].…”
Section: Criteriamentioning
confidence: 99%

A RAMS analysis for a precision scale-up configuration of “Smart Street" pilot site: an Industry 4.0 Case Study

Petritoli
1
,
Leccese
2
,
Botticelli
3
et al. 2019
ACTA IMEKO
14
0
6
0
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“…In the FMECA, the entire system is examined on a functional level, and the effects of failures and malfunctions on the performance of the equipment are determined. The interface circuits of the various subsystems, on the other hand, are analysed at the component level [83].…”
Section: Criteriamentioning
confidence: 99%

A RAMS analysis for a precision scale-up configuration of “Smart Street" pilot site: an Industry 4.0 Case Study

Petritoli
1
,
Leccese
2
,
Botticelli
3
et al. 2019
ACTA IMEKO
14
0
6
0
View full textAdd to dashboardCite
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Electromigration Induced Voiding and Resistance Change in Three-Dimensional Copper through Silicon Vias

Rovitto
1
,
Ceric
2
2016
2016 IEEE 66th Electronic Components and Technology Conference (ECTC)
5
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0
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Finite element modeling on electromigration of TSV interconnect in 3D package

Zhang
1
,
Yu
2
,
Shen
3
2018
2018 IEEE 20th Electronics Packaging Technology Conference (EPTC)
4
0
3
0
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