2023 IEEE 32nd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) 2023
DOI: 10.1109/epeps58208.2023.10314906
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Analysis of Electrostatically Induced Interconnect Structures in Single-Layer Graphene via a Conservative First-Principles Modeling Technique

Emile Vanderstraeten,
Dries Vande Ginste

Abstract: Electrostatically induced interconnect structures in graphene are an alluring alternative for nanoribbons to be used in future integrated circuits (ICs) because of the avoidance of edge scattering. In this contribution, these structures are analyzed using a novel first-principles modeling approach, based on higherorder conservative partitioned Runge-Kutta time stepping for the (2+1)D Dirac equation. The validity and applicability of the modeling tool are demonstrated by applying it to a bent interconnect and t… Show more

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