2015 International Conference on Electronic Packaging and iMAPS All Asia Conference (ICEP-IAAC) 2015
DOI: 10.1109/icep-iaac.2015.7111117
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Analysis of LED wire bonding process using arbitrary Lagrangian-Eulerian and equilibrium mesh smoothing algorithm

Chih-Chyau Yang1,
Chia-Chi Tsai2,
Yu-Chung Su3
et al.
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