Analysis of Multilayer Structure Near- and Far-Field Radiation by the Coupled PP-PEEC and Field-Equivalence Principle Method

Li, Yan; Cao, Wenyuan; Zuo, Panpan; Li, Yongsheng; Gao, Zhiyi; Wang, Mengjun; Zheng, Hongxing; Li, Er‐Ping

doi:10.1109/temc.2018.2819721

Cited by 11 publications

(2 citation statements)

References 19 publications

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“…The advent of 5G has led higher operating frequencies and integration levels of existing electronic equipment, and EMI problems become increasingly serious [1]. In order to solve such problems, reflection and absorption schemes are generally used for radiation suppression [2].…”

Section: Introductionmentioning

confidence: 99%

Design and Analysis of a Novel Compact Metamaterial Absorber Based on Double-Layer ITO Resistive Film for Improving Signal Integrity

Lei

Huo

et al. 2022

IEEE Access

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This paper presents a compact metamaterial absorber (MMA) based on double-layer ITO resistive film for suppression of electromagnetic interference (EMI) to improve signal quality and signal integrity (SI). In the design of MMA, based on the classic Jerusalem cross, circular and fan-shaped structures are combined to increase its equivalent capacitance to achieve frequency shift, and an equivalent circuit model is established to analyze the key factors affecting its absorption rate. At the same time, the fullwave simulation results show that more than 90% absorption rate is achieved in the frequency range of 8.9 GHz-14.0 GHz, and the measurement results show that the absorption rate of MMA at different incident angles is consistent with the simulation. Moreover, microstrip antenna and differential microstrip transmission line are also designed as equivalent radiation sources. The co-simulation results show that the 3 m field radiation of the patch antenna is reduced by 10 dBµV at 10 GHz. At the same time, the eye height of the differential microstrip transmission line has increased from 68 mV to 340 mV, indicating that the signal integrity problem has been significantly improved. The size of the unit is only about 0.065 λ L ×0.065 λ L where λ L is the wavelength of the lowest frequency, and the total thickness of the absorber is only 0.047 λ L . The proposed MMA has the characteristics of miniaturization, ultra-wideband, high absorption rate, and polarization insensitivity, which provides a new suppression method for the radiation problem of gradually miniaturized electronic equipment.

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Section: Introductionmentioning

confidence: 99%

Design and Analysis of a Novel Compact Metamaterial Absorber Based on Double-Layer ITO Resistive Film for Improving Signal Integrity

Lei

Huo

et al. 2022

IEEE Access

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“…As the package lid and heatsink are close to the surface of ICs, part of the noise will be coupled to the package lid and heatsink through the electric field. Since a resonant cavity is formed between the ground plane and heatsink, the electromagnetic wave is reflected back and forth between the two metal planes, resulting in a substantial enhancement of electromagnetic radiation [3].…”

Section: Introductionmentioning

confidence: 99%

Analysis of a Novel Resistive Film Absorber for Suppression of Electromagnetic Radiation in System-in-Packages

Huo

Lei

et al. 2022

International Journal of Antennas and Propagation

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This paper presents a new method to suppress the electromagnetic radiation between the heatsink and packaging substrate in the system-in-package by using a resistance film absorber. The proposed absorber is designed with the indium tin oxide sputtered on both sides of the glass substrate, and the top layer adopts the combination of Jerusalem cross-shaped, ring-shaped, and L-shaped resistive film to expand the bandwidth. The unit size of the absorber is 0.14 λ L × 0.14 λ L and the thickness is 0.049 λ L . It has an absorptivity of more than 90% in the frequency range of 21 GHz to 55 GHz with polarization insensitivity, and angular stability. Moreover, the radiated electric field from the chip package at 3 m is significantly reduced when employing the proposed absorber, and the maximum suppression of the electric field reaches 18 dB. Finally, the measurement results are carried out to verify the simulation results. Both simulation and experiment results demonstrate that the proposed absorber has excellent radiation suppression, which can be properly applied to electromagnetic interference suppression of the printed circuit board.

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Augmented PEEC for direct time-domain thermal and power estimation of Integrated Voltage Regulator architectures arising in Heterogeneous Integration

Avula

Smet

Joshi

et al. 2020

2020 IEEE 29th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

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Analysis of Multilayer Structure Near- and Far-Field Radiation by the Coupled PP-PEEC and Field-Equivalence Principle Method

Cited by 11 publications

References 19 publications

Design and Analysis of a Novel Compact Metamaterial Absorber Based on Double-Layer ITO Resistive Film for Improving Signal Integrity

Design and Analysis of a Novel Compact Metamaterial Absorber Based on Double-Layer ITO Resistive Film for Improving Signal Integrity

Analysis of a Novel Resistive Film Absorber for Suppression of Electromagnetic Radiation in System-in-Packages

Augmented PEEC for direct time-domain thermal and power estimation of Integrated Voltage Regulator architectures arising in Heterogeneous Integration

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