Analysis of reflections for different electronic modules

Abstract

In the paper will be analyzed the reflections for different electronic modules, and for this will be computed, simulated and measured the voltage of reflection €or different situations. For a complex evaluation of reflection, different experimental electronic modules will be realized: double PCB realized in classically technology (with FR4 substrate) and FELA (special laminates and structures having various types of glass as base and dielectric substrate or even a conductive substrate as solid aluminum and the dielectric as a thin sheet between the base metal and the layer containing traces); the technological type of digital circuit. The measured results will be compared with computed and simulated results. An interesting comparison will be realized between the FR4 and mLA technology.